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NCP580SQ30T1G

Onsemi

NCP580SQ30T1G by Onsemi

NCP580SQ30T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 3V Nominal Output Voltage, 0.28V Max Dropout Voltage, and 0.12A Max Output Current. Ideal for applications requiring stable voltage regulation in compact spaces due to its small outline thin profile package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,973 parts In-Stock

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Digiode

USA . 1,002 parts In-Stock

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AZTECH Wire

Italy . 580 parts In-Stock

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$9.010

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580

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Problanco Electronics

Mexico . 7,691 parts In-Stock

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TANS Electronics

Latvia . 2,436 parts In-Stock

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Corphita

USA . 2,041 parts In-Stock

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UHIMA Technologies

Türkiye . 820 parts In-Stock

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Kulean Microsystems

USA . 756 parts In-Stock

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SupplyDigital Components

Austria . 694 parts In-Stock

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Corohmni

South Africa . 455 parts In-Stock

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Microchip USA

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Overview

Elevate your electronic designs with the NCP580SQ30T1G by Onsemi, a top-tier manufacturer known for their cutting-edge technology and superior quality. This fixed positive single output LDO regulator offers a seamless solution for a wide range of applications, ensuring stable and reliable power supply. With precise voltage regulation and minimal dropout voltage, this regulator provides unmatched performance and efficiency. Trust Onsemi to deliver excellence in every component, giving you the peace of mind that your projects are in good hands. Choose the NCP580SQ30T1G for unparalleled value and performance in your electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various applications.

Maximum Dropout Voltage-1: 1.28 V

Low dropout voltage ensures efficient performance and minimal power loss.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Operating Temperature (TJ-Max): 85 °C

Wide operating temperature range allows for use in different environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into various circuit designs.

Terminal Form: GULL WING

Gull wing terminals provide secure connectivity and ease of soldering.

Operating Temperature (TJ-Min): -40 °C

Ability to operate at low temperatures enhances the product's versatility.

Minimum Output Voltage-1: 2.955 V

Stable minimum output voltage ensures consistent performance.

Maximum Voltage Tolerance: 1.5 %

Tight voltage tolerance ensures accurate output voltage regulation.

Nominal Output Voltage-1: 3 V

Stable nominal output voltage for reliable power supply.

No. of Terminals: 4

Sufficient number of terminals for easy connection in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Compact size and thin profile for space-constrained applications.

Adjustability: FIXED

Fixed output voltage eliminates the need for calibration and simplifies design.

Terminal Pitch: 1.3 mm

Close terminal pitch for compact layout and efficient PCB design.

Maximum Line Regulation: 0.0075 %

Minimal line regulation ensures stable output voltage under varying input conditions.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator provides accurate voltage regulation with low dropout voltage.

Terminal Finish: TIN

Tin finish on terminals for good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position for flexibility in circuit connection.

Maximum Output Voltage-1: 3.045 V

Maximum output voltage slightly above nominal value for added margin of safety.

Maximum Seated Height: 1.1 mm

Low seated height for compact and space-saving design.

Width: 1.25 mm

Narrow width for efficient PCB layout and space optimization.

Maximum Load Regulation: 0.04 %

Low load regulation for stable output voltage under varying load conditions.

Minimum Input Voltage: 2.2 V

Low minimum input voltage requirement for versatility in power supply applications.

Maximum Output Current-1: 0.12 A

Sufficient output current capability for powering a variety of electronic devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering and assembly process.

Nominal Dropout Voltage-1: 0.18 V

Low dropout voltage ensures efficient power conversion with minimal power loss.

Length: 2 mm

Compact length for space-saving design and efficient PCB layout.

Maximum Input Voltage: 6 V

Wide input voltage range for compatibility with various power sources.

Maximum Input Voltage Absolute: 6.5 V

Absolute maximum input voltage tolerance for added protection against voltage spikes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP580SQ30T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.28 V

Nominal Dropout Voltage-1:

.18 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.2 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Maximum Line Regulation:

.0075 %

Maximum Load Regulation:

.04 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.12 A

Maximum Output Voltage-1:

3.045 V

Minimum Output Voltage-1:

2.955 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOT-343R

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

1.25 mm

Trade Compliance

NCP580SQ30T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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