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NCP561SN33T1G

Onsemi

NCP561SN33T1G by Onsemi

NCP561SN33T1G by Onsemi is a 3.3V fixed positive single output LDO regulator with a max dropout voltage of 0.2V and max output current of 0.15A. It is ideal for applications requiring stable voltage regulation in compact spaces, such as IoT devices or portable electronics due to its small outline package style and low dropout voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 5,304 parts In-Stock

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Florida Circuit

USA . 3,000 parts In-Stock

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Ashlea Components Ltd

UK . 2,858 parts In-Stock

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Digiode

USA . 1,610 parts In-Stock

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Pegasus Components GmbH

Germany . 1,160 parts In-Stock

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Speed Components Ltd

Israel . 550 parts In-Stock

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AZTECH Wire

Italy . 393 parts In-Stock

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Kepictronics

USA . 23,580 parts In-Stock

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Problanco Electronics

Mexico . 6,091 parts In-Stock

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SupplyDigital Components

Austria . 5,365 parts In-Stock

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TANS Electronics

Latvia . 4,659 parts In-Stock

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Kulean Microsystems

USA . 2,805 parts In-Stock

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Corohmni

South Africa . 325 parts In-Stock

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Corphita

USA . 280 parts In-Stock

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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Microchip USA

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NCP561SN33T1G, a top-of-the-line fixed regulator that offers a seamless solution for various applications. This LDO regulator boasts superior performance and efficiency, providing customers with stable output voltage at a competitive price point. With its small outline and thin profile package design, this regulator is perfect for space-constrained projects where precision is key. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Choose the NCP561SN33T1G for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the regulator.

Maximum Dropout Voltage: 1.2 V

Low dropout voltage allows for efficient regulation of the output voltage even when the input voltage is close to the output voltage.

Surface Mount: YES

Surface mount capability makes it easy to integrate this regulator into compact electronic designs.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature range makes this regulator suitable for a wide range of operating conditions.

Technology: CMOS

CMOS technology ensures low power consumption and efficient operation of the regulator.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and installation of the regulator on a PCB.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering and connection points for reliable performance.

Nominal Output Voltage: 3.3 V

Stable and accurate output voltage of 3.3V makes this regulator ideal for powering various electronic components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim design with shrink pitch enhances the overall space efficiency of the regulator on the PCB.

Maximum Operating Temperature: 85 °C

The regulator can operate efficiently at temperatures up to 85 °C, ensuring reliable performance in various environments.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP561SN33T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.2 V

Nominal Dropout Voltage-1:

.13 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.06 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

2.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCP561SN33T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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