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NCP512SQ31T2G

Onsemi

NCP512SQ31T2G by Onsemi

NCP512SQ31T2G by Onsemi is a CMOS LDO regulator with 3.1V output voltage, 0.08A output current, and 0.3V dropout voltage. Ideal for applications requiring fixed positive single output regulators in compact spaces due to its small outline package style and surface mount capability. Operating temperature range from -40°C to 85°C makes it versatile for various electronic devices.

Median Price

$0.279

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 56,494 parts In-Stock

1+ parts

-

100+ parts

$0.302

1k+ parts

$0.251

10k+ parts

$0.223

56,494

-

$0.302

$0.251

$0.223

Verical

USA . 24,000 parts In-Stock

1+ parts

-

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$0.279

24,000

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$0.279

Mouser Electronics

USA . 676 parts In-Stock

1+ parts

-

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-

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$0.214

676

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$0.214

Distributors (In-Stock)

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Digiode

USA . 883 parts In-Stock

1+ parts

$0.235

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883

$0.235

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Vyrian

USA . 6,622 parts In-Stock

1+ parts

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6,622

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Bristol Electronics

USA . 4,696 parts In-Stock

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4,696

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Dan-Mar Components

USA . 4,696 parts In-Stock

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4,696

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Distributors (Availability)

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Corohmni

South Africa . 247 parts In-Stock

1+ parts

$0.214

100+ parts

-

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247

$0.214

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Corphita

USA . 648 parts In-Stock

1+ parts

$0.222

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648

$0.222

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Vigor

Singapore . 982 parts In-Stock

1+ parts

$0.240

100+ parts

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982

$0.240

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Continental Prestige Electronics

USA . 54,000 parts In-Stock

1+ parts

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100+ parts

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$0.179

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54,000

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$0.179

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Kepictronics

USA . 33,537 parts In-Stock

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Perfect Parts

USA . 10,416 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,427 parts In-Stock

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5,427

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 4,042 parts In-Stock

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Problanco Electronics

Mexico . 3,007 parts In-Stock

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3,007

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,588 parts In-Stock

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Kulean Microsystems

USA . 2,217 parts In-Stock

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Assy Fe

Spain . 2,200 parts In-Stock

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UHIMA Technologies

Türkiye . 368 parts In-Stock

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368

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Microchip USA

USA . 283 parts In-Stock

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Overview

Enhance your electronic designs with the NCP512SQ31T2G by Onsemi, a top-tier manufacturer known for delivering high-quality components. This Fixed Regulator offers reliable performance and precise voltage regulation in a compact package, ideal for various applications. Say goodbye to voltage fluctuations and hello to seamless operation with this LDO regulator. Trust Onsemi to provide cutting-edge technology and unmatched value, ensuring your projects run smoothly every time. Step up your game with the NCP512SQ31T2G and experience the difference today.

Feature Benefit Bullets

Maximum Dropout Voltage-1: 1.3 V

Low dropout voltage ensures minimal power loss and better efficiency for the device.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range enables the device to function effectively in various environments.

Nominal Output Voltage-1: 3.1 V

Stable and accurate output voltage ensures reliable performance of the device.

Maximum Output Current-1: 0.08 A

Sufficient output current capability for many low-power applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP512SQ31T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.17 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

4.1 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Maximum Load Regulation:

.0632 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.08 A

Maximum Output Voltage-1:

3.193 V

Minimum Output Voltage-1:

3.007 V

Nominal Output Voltage-1:

3.1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

1.25 mm

Trade Compliance

NCP512SQ31T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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