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NCP512SQ18T1G

Onsemi

NCP512SQ18T1G by Onsemi

NCP512SQ18T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 1.8V Nominal Output Voltage, 0.45V Max Dropout Voltage, and 0.08A Max Output Current. It is ideal for applications requiring stable voltage regulation in compact spaces due to its small outline package style and thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,333 parts In-Stock

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Digiode

USA . 511 parts In-Stock

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AZTECH Wire

Italy . 578 parts In-Stock

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$21.850

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578

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Metaverse IC Inc.

Canada . 169,090 parts In-Stock

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Kepictronics

USA . 26,801 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,830 parts In-Stock

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SupplyDigital Components

Austria . 8,321 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,820 parts In-Stock

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TANS Electronics

Latvia . 4,998 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,181 parts In-Stock

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Problanco Electronics

Mexico . 2,113 parts In-Stock

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Kulean Microsystems

USA . 2,055 parts In-Stock

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Vigor

Singapore . 259 parts In-Stock

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Microchip USA

USA . 243 parts In-Stock

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Corohmni

South Africa . 95 parts In-Stock

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Perfect Parts

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Overview

Upgrade your electronic devices with the NCP512SQ18T1G by Onsemi. Manufactured with precision and expertise, this Fixed Positive Single Output LDO Regulator offers reliable performance and high-quality output voltage of 1.8V. With a compact design and advanced CMOS technology, this regulator is perfect for a wide range of applications. Say goodbye to voltage fluctuations and ensure smooth operation for your devices. Trust Onsemi to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Maximum Dropout Voltage: 1.45 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB assembly.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range makes this regulator suitable for a variety of different environments and applications.

Technology: CMOS

CMOS technology enables low power consumption and high efficiency in operation.

Minimum Output Voltage: 1.746 V

Low minimum output voltage allows for powering sensitive components or devices that require precise voltage levels.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP512SQ18T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.45 V

Nominal Dropout Voltage-1:

.35 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.8 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Maximum Line Regulation:

.0096 %

Maximum Load Regulation:

.0632 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.08 A

Maximum Output Voltage-1:

1.854 V

Minimum Output Voltage-1:

1.746 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

3 %

Width:

1.25 mm

Trade Compliance

NCP512SQ18T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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