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NCP502SQ30T1G

Onsemi

NCP502SQ30T1G by Onsemi

NCP502SQ30T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 3V Nominal Output Voltage, 0.08A Max Output Current, and 1.2V Max Dropout Voltage. It is ideal for applications requiring stable voltage regulation in compact spaces due to its small outline package style and thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,188 parts In-Stock

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Digiode

USA . 439 parts In-Stock

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439

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Prism Electronics

USA . 50 parts In-Stock

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50

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Vigor

Singapore . 360 parts In-Stock

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$0.290

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360

$0.290

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AZTECH Wire

Italy . 700 parts In-Stock

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$10.160

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700

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Component Stockers USA

USA . 369 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,513 parts In-Stock

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Metaverse IC Inc.

Canada . 10,999 parts In-Stock

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Problanco Electronics

Mexico . 4,186 parts In-Stock

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Microchip USA

USA . 4,008 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Kulean Microsystems

USA . 3,864 parts In-Stock

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UHIMA Technologies

Türkiye . 903 parts In-Stock

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SupplyDigital Components

Austria . 305 parts In-Stock

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Corphita

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TANS Electronics

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Corohmni

South Africa . 62 parts In-Stock

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Perfect Parts

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Overview

Experience unparalleled quality and reliability with the NCP502SQ30T1G by Onsemi. As a leading manufacturer in the industry, Onsemi offers fixed regulators that are perfect for a wide range of applications. From consumer electronics to automotive systems, this LDO regulator provides stable and precise output voltage, ensuring optimal performance for your devices. Trust Onsemi to deliver exceptional value, benefits, and advantages with the NCP502SQ30T1G, taking your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability of the regulator.

Maximum Dropout Voltage-1: 1.2 V

Low dropout voltage of 1.2V allows for efficient regulation of the output voltage even when the input voltage is close to the output voltage.

Operating Temperature (TJ-Max): 150 °C

With a high operating temperature of 150 °C, this regulator can withstand demanding thermal conditions, making it suitable for a variety of applications.

Technology: CMOS

CMOS technology offers high efficiency and low power consumption, making this regulator an energy-efficient choice.

Minimum Output Voltage-1: 2.91 V

The minimum output voltage of 2.91V ensures stable output voltage regulation even under low load conditions.

Nominal Output Voltage-1: 3 V

A nominal output voltage of 3V provides a reliable and consistent voltage supply for connected devices.

Maximum Output Current-1: 0.08 A

With a maximum output current of 0.08A, this regulator is suitable for powering low-power devices efficiently.

Maximum Input Voltage: 12 V

The regulator can handle input voltages of up to 12V, making it versatile and compatible with a wide range of power sources.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP502SQ30T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.2 V

Nominal Dropout Voltage-1:

.85 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Maximum Line Regulation:

.024 %

Maximum Load Regulation:

.0632 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.08 A

Maximum Output Voltage-1:

3.09 V

Minimum Output Voltage-1:

2.91 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

1.25 mm

Trade Compliance

NCP502SQ30T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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