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NCP3985SN25T1G

Onsemi

NCP3985SN25T1G by Onsemi

NCP3985SN25T1G by Onsemi is a BICMOS technology LDO regulator with 2.5V output voltage, 0.15A max current, and 150 °C operating temp. Ideal for applications requiring fixed positive single output regulators in compact designs due to its small outline package style and low dropout voltage of 0.105V.

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2

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1k+

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Vyrian

USA . 8,848 parts In-Stock

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Digiode

USA . 423 parts In-Stock

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AZTECH Wire

Italy . 1,180 parts In-Stock

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$8.210

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Metaverse IC Inc.

Canada . 34,333 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,025 parts In-Stock

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Kepictronics

USA . 16,000 parts In-Stock

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Problanco Electronics

Mexico . 7,986 parts In-Stock

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Kulean Microsystems

USA . 7,750 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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TANS Electronics

Latvia . 2,978 parts In-Stock

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SupplyDigital Components

Austria . 2,752 parts In-Stock

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Corphita

USA . 2,226 parts In-Stock

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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Microchip USA

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Overview

Unlock the power of reliable voltage regulation with the NCP3985SN25T1G by Onsemi. Crafted with precision and expertise, this fixed positive single output LDO regulator offers unparalleled stability and performance for a wide range of applications. From industrial equipment to consumer electronics, this small outline, thin profile package delivers a seamless voltage output, ensuring your devices run smoothly and efficiently. Trust Onsemi's legacy of quality and innovation to elevate your projects to new heights with the NCP3985SN25T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the regulator, making it suitable for various applications.

Maximum Dropout Voltage-1: 0.155 V

Low dropout voltage ensures efficient operation and minimal power loss in the system.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range enables reliable performance in different environmental conditions.

Technology: BICMOS

BICMOS technology offers a balance of performance and power efficiency, enhancing overall product reliability.

Package Shape: RECTANGULAR

Rectangular shape facilitates efficient placement and integration into electronic systems.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during installation.

Minimum Output Voltage-1: 2.425 V

Stable minimum output voltage ensures consistent power supply to connected devices.

Maximum Voltage Tolerance: 3 %

Tight voltage tolerance helps maintain precise output voltage levels for sensitive components.

Nominal Output Voltage-1: 2.5 V

Standard output voltage suitable for various electronic applications.

No. of Terminals: 5

Sufficient number of terminals for reliable connections and easy installation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for efficient design layout.

Adjustability: FIXED

Fixed output voltage eliminates the need for adjustment and simplifies system setup.

Terminal Pitch: 0.95 mm

Fine terminal pitch enables high-density mounting on the PCB with precision.

Maximum Line Regulation: 0.0125 %

Low line regulation ensures stable output voltage despite fluctuations in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator provides reliable and stable power supply for sensitive electronic components.

Terminal Finish: TIN

Tin terminal finish offers excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout options and ease of connection.

Maximum Output Voltage-1: 2.575 V

Higher maximum output voltage accommodates a wider range of application requirements.

Maximum Seated Height: 1.1 mm

Low seated height minimizes space requirement and enables compact system design.

Width: 1.5 mm

Narrow width contributes to space-saving design and efficient layout on the PCB.

Minimum Input Voltage: 2.5 V

Specific minimum input voltage ensures proper operation and protection of the regulator.

Maximum Output Current-1: 0.15 A

Adequate maximum output current for powering various electronic devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for sufficient time at peak reflow temperature during assembly for reliable solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and assembly of the regulator.

Nominal Dropout Voltage-1: 0.105 V

Low dropout voltage minimizes power loss and enhances energy efficiency in the system.

Length: 3 mm

Compact length contributes to a space-saving design and efficient use of PCB real estate.

Maximum Input Voltage: 5.5 V

High maximum input voltage tolerance allows for a wide range of input voltage levels without risk of damage.

Maximum Input Voltage Absolute: 6 V

Absolute maximum input voltage rating ensures protection against voltage spikes and overvoltage conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP3985SN25T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.155 V

Nominal Dropout Voltage-1:

.105 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.0125 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

2.575 V

Minimum Output Voltage-1:

2.425 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCP3985SN25T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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