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NCP3985SN33T1G

Onsemi

NCP3985SN33T1G by Onsemi

NCP3985SN33T1G by Onsemi is a BICMOS technology LDO regulator with 3.3V output, 0.15A current, and 3% voltage tolerance. Ideal for applications requiring fixed positive single output regulators in compact spaces due to its small outline package style and low dropout voltage of 0.1V.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,159 parts In-Stock

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Chip Stock

USA . 3,287 parts In-Stock

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Digiode

USA . 2,189 parts In-Stock

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AZTECH Wire

Italy . 521 parts In-Stock

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$20.870

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521

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Kepictronics

USA . 33,000 parts In-Stock

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33,000

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,912 parts In-Stock

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SupplyDigital Components

Austria . 7,753 parts In-Stock

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Problanco Electronics

Mexico . 6,938 parts In-Stock

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Microchip USA

USA . 4,732 parts In-Stock

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TANS Electronics

Latvia . 1,512 parts In-Stock

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Corohmni

South Africa . 333 parts In-Stock

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UHIMA Technologies

Türkiye . 296 parts In-Stock

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Vigor

Singapore . 257 parts In-Stock

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Kulean Microsystems

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Corphita

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Overview

Unlock the power of reliable voltage regulation with the NCP3985SN33T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality fixed regulators that provide stable and precise output for a variety of applications. Whether you need to power your IoT devices, sensors, or consumer electronics, this LDO regulator offers superior performance with minimal dropout voltage. Trust Onsemi to deliver cutting-edge technology in a compact package, ensuring your projects run smoothly and efficiently. Experience the difference with the NCP3985SN33T1G and elevate your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Dropout Voltage-1: 0.15 V

Low dropout voltage ensures efficient performance and minimal power loss.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB assembly.

Operating Temperature (TJ-Max): 150 °C

High operating temperature range ensures stability and reliability in various environments.

Technology: BICMOS

BICMOS technology offers a good balance between speed and power consumption.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy integration.

Terminal Form: GULL WING

Gull wing terminal form provides reliable electrical connection and ease of soldering.

Packing Method: TR

TR packing method is suitable for automated assembly processes and protects the product during shipping.

Minimum Output Voltage-1: 3.201 V

Stable minimum output voltage ensures consistent performance under different load conditions.

Maximum Voltage Tolerance: 3 %

Low voltage tolerance ensures accurate output voltage regulation.

Nominal Output Voltage-1: 3.3 V

Standard nominal output voltage suitable for various electronic applications.

No. of Terminals: 5

Adequate number of terminals for easy connection and installation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile saves space on the PCB and enables dense designs.

Adjustability: FIXED

Fixed output voltage eliminates the need for additional components or adjustments.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for high-density mounting and compact PCB layouts.

Maximum Line Regulation: 0.0112 %

Low line regulation ensures stable output voltage despite fluctuations in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator provides a stable and low-noise output voltage for sensitive electronic components.

Terminal Finish: TIN

Tin terminal finish offers good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and routing.

Maximum Output Voltage-1: 3.399 V

Higher maximum output voltage for applications requiring slightly higher voltage levels.

Maximum Seated Height: 1.1 mm

Low seated height enables compact and slim designs.

Width: 1.5 mm

Narrow width for space-efficient PCB layouts.

Maximum Load Regulation: 0.025 %

Low load regulation ensures stable output voltage across varying load conditions.

Minimum Input Voltage: 2.5 V

Low minimum input voltage requirement for compatibility with various power sources.

Maximum Output Current-1: 0.15 A

Adequate output current capability for powering a range of electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature for reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for durability and robustness in assembly processes.

Nominal Dropout Voltage-1: 0.1 V

Low dropout voltage ensures efficiency and minimal power dissipation.

Length: 3 mm

Compact length for space-saving PCB designs.

Maximum Input Voltage: 5.5 V

High maximum input voltage rating for compatibility with a wide range of power sources.

Maximum Input Voltage Absolute: 6 V

Absolute maximum input voltage ensures protection against voltage spikes or overvoltage conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP3985SN33T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.15 V

Nominal Dropout Voltage-1:

.1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.0112 %

Maximum Load Regulation:

.025 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCP3985SN33T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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