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NCP160BMX275TBG

Onsemi

NCP160BMX275TBG by Onsemi

NCP160BMX275TBG by Onsemi is a fixed positive single output LDO regulator with an output voltage of 2.75V and max current of 0.25A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces. The package style is small outline with very thin profile, ideal for space-constrained designs that demand efficient heat dissipation.

Median Price

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Lifecycle Status

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4

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1k+

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Flip Electronics (Authorized)

USA . 102,000 parts In-Stock

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Flip Electronics

USA . 102,000 parts In-Stock

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Vyrian

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Digiode

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Microchip USA

USA . 7,377 parts In-Stock

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$0.678

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AZTECH Wire

Italy . 326 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,154 parts In-Stock

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SupplyDigital Components

Austria . 8,037 parts In-Stock

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Problanco Electronics

Mexico . 7,863 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Kulean Microsystems

USA . 5,106 parts In-Stock

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TANS Electronics

Latvia . 2,306 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 352 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the NCP160BMX275TBG Fixed Regulator. Designed to deliver a stable output voltage, this LDO regulator is perfect for a range of applications. The package design ensures easy installation and the high operating temperature makes it suitable for diverse environments. Trust in Onsemi's expertise and value this product brings to your projects. Elevate your electronics with the NCP160BMX275TBG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while keeping the product lightweight, making it ideal for applications where weight is a concern.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, reducing assembly time and cost.

Operating Temperature (TJ-Max): 125 °C

Ensures reliable operation even in high temperature environments, making it suitable for a wide range of applications.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations.

Minimum Output Voltage-1: 2.695 V

Provides a stable and precise output voltage for powering sensitive electronic components.

Nominal Output Voltage-1: 2.75 V

Offers a standard output voltage that is commonly used in various electronic devices.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

A fixed positive LDO regulator provides a steady output voltage, ensuring consistent performance of the connected devices.

Nominal Dropout Voltage-1: 1 V

The low dropout voltage minimizes power dissipation and helps conserve energy.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP160BMX275TBG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.7 V

JESD-30 Code:

S-PDSO-N4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

2.805 V

Minimum Output Voltage-1:

2.695 V

Nominal Output Voltage-1:

2.75 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.43 mm

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

1 mm

Trade Compliance

NCP160BMX275TBG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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