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NCP160BMX1825TBG

Onsemi

NCP160BMX1825TBG by Onsemi

NCP160BMX1825TBG by Onsemi is a fixed positive single output LDO regulator with an output voltage of 1.825V and max current of 0.25A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces. The package style is small outline with a very thin profile, ideal for surface mount designs where space is limited.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 11,125 parts In-Stock

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Digiode

USA . 2,356 parts In-Stock

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Microchip USA

USA . 6,811 parts In-Stock

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$0.678

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AZTECH Wire

Italy . 835 parts In-Stock

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$8.550

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835

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TANS Electronics

Latvia . 8,008 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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7,000

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Kulean Microsystems

USA . 6,637 parts In-Stock

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SupplyDigital Components

Austria . 4,186 parts In-Stock

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Corphita

USA . 1,986 parts In-Stock

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Problanco Electronics

Mexico . 1,918 parts In-Stock

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Corohmni

South Africa . 461 parts In-Stock

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UHIMA Technologies

Türkiye . 435 parts In-Stock

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Overview

Looking for a reliable and high-quality fixed regulator for your electronic devices? Look no further than the NCP160BMX1825TBG by Onsemi. With Onsemi's reputation for excellence in manufacturing, you can trust that this product will deliver top-notch performance. This single output LDO regulator is perfect for a wide range of applications, providing stable voltage to ensure your devices run smoothly. Don't compromise on quality - choose the NCP160BMX1825TBG for unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or space-constrained applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and costs.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB and aids in thermal management.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Form: NO LEAD

No lead terminals reduce the risk of lead contamination and make the product more environmentally friendly.

Packing Method: TR

TR packing method ensures safe and secure transportation of the product, reducing the risk of damage during shipping.

Minimum Output Voltage-1: 1.7885 V

Low minimum output voltage allows for flexibility and compatibility with a wide range of applications.

Maximum Voltage Tolerance: 2 %

High voltage tolerance ensures stable and accurate output voltage regulation, improving overall system performance.

Nominal Output Voltage-1: 1.825 V

Stable nominal output voltage ensures consistent operation of connected components, reducing the risk of damage due to voltage fluctuations.

No. of Terminals: 4

Four terminals provide secure connections and enhance the overall reliability of the product.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline and thin profile package style saves space on the PCB while the heat sink/slug design helps dissipate heat efficiently, increasing product lifespan.

Adjustability: FIXED

Fixed adjustability simplifies design and eliminates the need for additional circuitry, making the product easier to use and integrate.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for compact PCB layout and efficient use of space.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed positive single output LDO regulator provides stable and reliable voltage regulation, ensuring consistent performance of connected devices.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel gold palladium terminal finish provides excellent conductivity and corrosion resistance, improving overall product reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB mounting and allows for secure connections.

Maximum Output Voltage-1: 1.8615 V

High maximum output voltage provides necessary headroom for voltage fluctuations, ensuring stable operation of connected components.

Maximum Seated Height: 0.43 mm

Low maximum seated height saves space on the PCB and aids in overall system miniaturization.

Width: 1 mm

Compact width makes the product suitable for applications with limited space constraints.

Minimum Input Voltage: 1.9 V

Low minimum input voltage requirement allows for compatibility with a wide range of power sources.

Maximum Output Current-1: 0.25 A

High maximum output current rating allows for powering of a variety of loads, making the product versatile and suitable for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for efficient and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and product reliability during assembly.

Nominal Dropout Voltage-1: 1 V

Low dropout voltage minimizes power loss and ensures efficient operation of the regulator.

Length: 1 mm

Compact length saves space on the PCB and aids in overall system miniaturization.

Maximum Input Voltage: 5.5 V

High maximum input voltage rating allows for flexibility in power source selection and compatibility with different supply voltages.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP160BMX1825TBG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.9 V

JESD-30 Code:

S-PDSO-N4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

1.8615 V

Minimum Output Voltage-1:

1.7885 V

Nominal Output Voltage-1:

1.825 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.43 mm

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

1 mm

Trade Compliance

NCP160BMX1825TBG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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