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NCP1606BPG

Onsemi

NCP1606BPG by Onsemi

NCP1606BPG by Onsemi is a VOLTAGE-MODE switcher with 12V supply, 70 kHz switching frequency, and 3mA supply current. Ideal for POWER FACTOR CONTROL applications due to its BOOST configuration and PULSE FREQUENCY MODULATION control technique in an 8-terminal PLASTIC/EPOXY package.

Median Price

$0.619

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,148 parts In-Stock

1+ parts

-

100+ parts

$0.608

1k+ parts

$0.504

10k+ parts

$0.450

29,148

-

$0.608

$0.504

$0.450

Verical

USA . 8,778 parts In-Stock

1+ parts

-

100+ parts

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$0.630

10k+ parts

$0.562

8,778

-

-

$0.630

$0.562

Distributors (In-Stock)

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Digiode

USA . 780 parts In-Stock

1+ parts

$0.473

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780

$0.473

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Vyrian

USA . 7,784 parts In-Stock

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7,784

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PC Components Company LLC

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Corphita

USA . 1,557 parts In-Stock

1+ parts

$0.448

100+ parts

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1,557

$0.448

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Vigor

Singapore . 339 parts In-Stock

1+ parts

$0.480

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339

$0.480

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Corohmni

South Africa . 168 parts In-Stock

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$0.498

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168

$0.498

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AZTECH Wire

Italy . 1,149 parts In-Stock

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$21.810

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1,149

$21.810

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Continental Prestige Electronics

USA . 29,148 parts In-Stock

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$0.489

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$0.489

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Perfect Parts

USA . 10,080 parts In-Stock

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Kulean Microsystems

USA . 7,007 parts In-Stock

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Problanco Electronics

Mexico . 6,810 parts In-Stock

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6,810

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TANS Electronics

Latvia . 5,435 parts In-Stock

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SupplyDigital Components

Austria . 2,439 parts In-Stock

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2,439

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 588 parts In-Stock

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588

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Microchip USA

USA . 253 parts In-Stock

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Overview

Unlock the power of efficient energy management with the NCP1606BPG from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The NCP1606BPG belongs to the Switching Regulators & Controllers category, offering a compact design and versatile applications. This innovative product provides customers with value by delivering optimal performance, increased energy efficiency, and precise voltage control. Experience the benefits of superior technology with the NCP1606BPG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the switching regulator, making it a reliable choice for long-term use.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V ensures compatibility with a wide range of applications that require this specific voltage, making it versatile for different projects.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this switching regulator can withstand elevated temperatures without compromising its performance, ensuring reliability in various environments.

Control Technique: PULSE FREQUENCY MODULATION

Using pulse frequency modulation allows for efficient control of the switching regulator, resulting in improved power conversion and reduced energy wastage, making it an energy-efficient choice.

Switcher Config: BOOST

Having a boost switcher configuration enables the switching regulator to step up the input voltage to a higher output voltage, providing flexibility in power supply applications where voltage boosting is required.

Technical Specifications

Switching Regulators & Controllers NCP1606BPG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE FREQUENCY MODULATION

Maximum Input Voltage:

20 V

Minimum Input Voltage:

10.3 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

3 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Switcher Config:

BOOST

Maximum Switching Frequency:

70 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NCP1606BPG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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