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NCP1602ACCSNT1G

Onsemi

NCP1602ACCSNT1G by Onsemi

NCP1602ACCSNT1G by Onsemi is a small outline, thin profile power factor controller with boost switcher config. It operates b/w -40 to 125 °C and supports input voltage range of 9.5-30V, making it ideal for automotive applications. With PWM control technique and matte tin finish, it offers efficient regulation in a compact package.

Median Price

$0.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,962 parts In-Stock

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$0.350

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Verical

USA . 2,962 parts In-Stock

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$0.350

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Chip1Stop

Japan . 2,962 parts In-Stock

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Digiode

USA . 827 parts In-Stock

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$0.337

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827

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Vyrian

USA . 6,779 parts In-Stock

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Vigor

Singapore . 288 parts In-Stock

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$0.307

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288

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Corphita

USA . 1,939 parts In-Stock

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$0.320

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Corohmni

South Africa . 484 parts In-Stock

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$0.355

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484

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AZTECH Wire

Italy . 1,193 parts In-Stock

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$16.960

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Perfect Parts

USA . 20,278 parts In-Stock

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TANS Electronics

Latvia . 7,974 parts In-Stock

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Problanco Electronics

Mexico . 7,452 parts In-Stock

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Kepictronics

USA . 7,043 parts In-Stock

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SupplyDigital Components

Austria . 4,957 parts In-Stock

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Kulean Microsystems

USA . 2,697 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 475 parts In-Stock

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Microchip USA

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Overview

Enhance your power management solutions with the NCP1602ACCSNT1G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality switching regulators & controllers that offer unparalleled reliability and performance. Ideal for automotive applications, this small outline, thin profile package provides efficient power factor control and pulse width modulation for optimal energy efficiency. With a wide input voltage range and high-temperature grade, the NCP1602ACCSNT1G ensures smooth operation in any environment. Upgrade your power systems today with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and protection for the internal components of the switching regulator.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier and more efficient.

No. of Terminals: 6

Having 6 terminals allows for versatile connection options and compatibility with a variety of circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this switching regulator can withstand harsh environmental conditions without compromising performance.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers precise control over the output voltage, leading to efficient power conversion.

Switcher Config: BOOST

Boost switcher configuration allows for step-up voltage conversion, making this product suitable for applications requiring higher output voltage than input voltage.

Technical Specifications

Switching Regulators & Controllers NCP1602ACCSNT1G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

9.5 V

Nominal Input Voltage:

18 V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP1602ACCSNT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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