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NCP1601BDR2G

Onsemi

NCP1601BDR2G by Onsemi

NCP1601BDR2G by Onsemi is a voltage-mode boost switching regulator with 15V nominal input/output voltage, 405kHz max switching frequency, and 0.75A max output current. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,861 parts In-Stock

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Digiode

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 534 parts In-Stock

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TANS Electronics

Latvia . 7,894 parts In-Stock

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Kulean Microsystems

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A-Z Elektronik GmbH

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Microchip USA

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Problanco Electronics

Mexico . 4,920 parts In-Stock

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SupplyDigital Components

Austria . 4,324 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,820 parts In-Stock

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UHIMA Technologies

Türkiye . 814 parts In-Stock

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Corphita

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Vigor

Singapore . 325 parts In-Stock

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Metaverse IC Inc.

Canada . 300 parts In-Stock

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Corohmni

South Africa . 168 parts In-Stock

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Overview

Enhance your power supply systems with the NCP1601BDR2G by Onsemi, a top-tier manufacturer in the industry. This switching regulator and controller offers unparalleled efficiency and reliability for a wide range of applications. With its compact design and advanced control mode, this product delivers optimal performance while maintaining a low power consumption rate. Trust Onsemi to provide you with cutting-edge technology that will elevate your projects to new heights. Choose the NCP1601BDR2G for superior quality and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the product, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 15 V

Suitable for use with a variety of devices that require a 15V power supply.

Maximum Operating Temperature: 125 °C

Ensures the product can operate reliably in high temperature environments, such as automotive applications.

Control Mode: VOLTAGE-MODE

Provides precise control of the output voltage, ensuring stable operation and efficient power conversion.

Maximum Output Current: 0.75 A

Capable of delivering up to 0.75 amps of current, making it suitable for powering a range of electronic devices.

Switcher Config: BOOST

Boost configuration allows for higher output voltages than the input voltage, expanding the range of compatible devices.

Technical Specifications

Switching Regulators & Controllers NCP1601BDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

9.75 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

5 mA

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

405 kHz

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

NCP1601BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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