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NCP1568G01DBR2G

Onsemi

NCP1568G01DBR2G by Onsemi

NCP1568G01DBR2G by Onsemi is a current-mode switching controller with max. operating temp of 125 °C, freq. up to 1000 kHz, and input voltage range from 10V to 27V. Ideal for automotive applications due to its small outline package style and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

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AZTECH Wire

Italy . 385 parts In-Stock

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Kulean Microsystems

USA . 7,626 parts In-Stock

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TANS Electronics

Latvia . 6,779 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 2,350 parts In-Stock

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SupplyDigital Components

Austria . 1,463 parts In-Stock

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UHIMA Technologies

Türkiye . 863 parts In-Stock

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Singapore . 500 parts In-Stock

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Overview

Unlock the full potential of your power management system with the NCP1568G01DBR2G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in each product. This switching regulator & controller is perfect for a wide range of applications, offering seamless integration and optimal performance. With advanced features like current-mode control and pulse width modulation, this compact and efficient device delivers unparalleled value and benefits to customers. Upgrade your power supply system today with the NCP1568G01DBR2G and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and ensures the product can withstand rough handling and harsh environments.

Surface Mount: YES

Surface mount design makes it easy to integrate into PCBs, saving space and facilitating automated assembly processes.

No. of Terminals: 12

Having 12 terminals allows for more flexibility in connection options and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability even under extreme conditions.

Control Mode: CURRENT-MODE

Current-mode control offers improved transient response and better noise immunity compared to voltage-mode control.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Nominal Input Voltage: 16 V

The nominal input voltage of 16V is suitable for a wide range of applications, providing versatility.

Maximum Switching Frequency: 1000 kHz

High switching frequency enables efficient power conversion with minimal ripple and noise.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures reliability and performance in automotive applications where temperature variations are common.

Maximum Supply Current (Isup): 16 mA

Low supply current consumption helps in reducing overall power consumption and increasing efficiency.

Technical Specifications

Switching Regulators & Controllers NCP1568G01DBR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

27 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

16 V

JESD-30 Code:

R-PDSO-G12

Length:

5 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TSSOP12/16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

16 mA

Surface Mount:

YES

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

NCP1568G01DBR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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