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NCP1529MU135TBG

Onsemi

NCP1529MU135TBG by Onsemi

NCP1529MU135TBG by Onsemi is a small outline switching regulator with 1A output current, 2200 kHz max switching frequency, and 85 °C max operating temp. Ideal for industrial applications requiring precise current-mode control in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,516 parts In-Stock

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Digiode

USA . 203 parts In-Stock

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Vigor

Singapore . 985 parts In-Stock

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$0.310

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985

$0.310

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AZTECH Wire

Italy . 585 parts In-Stock

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$17.440

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QUARKTWIN TECHNOLOGY LTD

USA . 18,724 parts In-Stock

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SupplyDigital Components

Austria . 7,375 parts In-Stock

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TANS Electronics

Latvia . 6,681 parts In-Stock

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Problanco Electronics

Mexico . 2,923 parts In-Stock

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Corphita

USA . 2,150 parts In-Stock

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Kulean Microsystems

USA . 1,524 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 628 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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Microchip USA

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Overview

Unlock the power of efficient energy management with the NCP1529MU135TBG by Onsemi. This cutting-edge switching regulator offers unparalleled quality and reliability, backed by Onsemi's reputation as a leading manufacturer in the industry. Ideal for a wide range of applications, this product provides customers with the value of precise voltage regulation, increased energy efficiency, and compact design. Say goodbye to wasted energy and hello to optimized performance with the NCP1529MU135TBG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the switching regulator, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the product easy to install on circuit boards, saving space and simplifying manufacturing processes.

No. of Terminals: 6

Having multiple terminals allows for efficient connections and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this switching regulator suitable for industrial applications where heat resistance is essential.

Control Mode: CURRENT-MODE

Current-mode control provides better stability and faster response to load changes, enhancing overall performance of the switching regulator.

Nominal Input Voltage: 3.6 V

The specified nominal input voltage ensures compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Output Current: 1 A

With a maximum output current of 1 A, this switching regulator can efficiently power moderate to high load devices.

Technical Specifications

Switching Regulators & Controllers NCP1529MU135TBG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

IT CAN ALSO OPERATE WITH PFM MODE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Nominal Output Voltage:

1.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NCP1529MU135TBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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