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NCP1529MU12TBG

Onsemi

NCP1529MU12TBG by Onsemi

NCP1529MU12TBG by Onsemi is a switching regulator with a max output current of 1A and a control mode of current-mode. It operates in an industrial temperature grade range from -40 °C to 85°C, making it suitable for various applications requiring efficient power management in compact spaces. With a small outline package style and very thin profile, this device is ideal for surface mount designs where space is limited.

Median Price

$2.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 867 parts In-Stock

1+ parts

$2.020

100+ parts

$0.692

1k+ parts

$0.606

10k+ parts

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867

$2.020

$0.692

$0.606

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Distributors (In-Stock)

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Digiode

USA . 500 parts In-Stock

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$1.919

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500

$1.919

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Vyrian

USA . 6,084 parts In-Stock

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Lantek

USA . 5,333 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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3,000

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Dan-Mar Components

USA . 3,000 parts In-Stock

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3,000

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Flip Electronics

USA . 900 parts In-Stock

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900

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Distributors (Availability)

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Vigor

Singapore . 500 parts In-Stock

1+ parts

$0.320

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500

$0.320

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Corphita

USA . 1,977 parts In-Stock

1+ parts

$1.818

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1,977

$1.818

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Corohmni

South Africa . 274 parts In-Stock

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$2.020

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274

$2.020

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AZTECH Wire

Italy . 96 parts In-Stock

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$10.370

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Component Stockers USA

USA . 307 parts In-Stock

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$99.990

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Perfect Parts

USA . 14,092 parts In-Stock

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RC Electronics

USA . 12,000 parts In-Stock

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Kulean Microsystems

USA . 5,845 parts In-Stock

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GreenTree Electronics

Israel . 5,333 parts In-Stock

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TANS Electronics

Latvia . 3,688 parts In-Stock

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Problanco Electronics

Mexico . 3,441 parts In-Stock

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SupplyDigital Components

Austria . 2,298 parts In-Stock

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Assy Fe

Spain . 1,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,530 parts In-Stock

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Kepictronics

USA . 710 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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UHIMA Technologies

Türkiye . 659 parts In-Stock

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Microchip USA

USA . 209 parts In-Stock

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Overview

Experience the unparalleled performance and reliability of the NCP1529MU12TBG switching regulator by Onsemi. With a focus on quality and innovation, Onsemi has crafted a product that is perfect for a wide range of applications. This small outline, heat sink/slider package offers customers a highly efficient solution for their power management needs. Enjoy the benefits of current-mode control, pulse width modulation, and a maximum output current of 1A. Trust Onsemi to provide you with top-notch technology that delivers value and efficiency in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components of the switching regulator, making it a reliable choice.

Surface Mount: YES

Being a surface mount device makes the switching regulator easy to install on circuit boards, saving space and allowing for efficient assembly.

Maximum Output Current: 1 A

With a maximum output current of 1A, this switching regulator can efficiently power electronic devices requiring up to 1 amp of current, making it suitable for a variety of applications.

Maximum Switching Frequency: 2200 kHz

The high switching frequency of 2200 kHz allows for faster response times and more precise regulation of the output voltage, enhancing the performance of the switching regulator.

Nominal Input Voltage: 3.6 V

The nominal input voltage of 3.6V provides a stable power source for the switching regulator, ensuring consistent and reliable operation.

Technical Specifications

Switching Regulators & Controllers NCP1529MU12TBG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

IT CAN ALSO OPERATE WITH PFM MODE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Nominal Output Voltage:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NCP1529MU12TBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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