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NCP1450ASN33T1

Onsemi

NCP1450ASN33T1 by Onsemi

NCP1450ASN33T1 by Onsemi is a voltage-mode switching controller with a max output current of 0.15A and a max switching frequency of 216kHz. It is designed for industrial applications, featuring a small outline package style and dual terminal position for compact designs. The device operates in temperatures ranging from -40 °C to 85°C, making it suitable for various power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,507 parts In-Stock

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Digiode

USA . 315 parts In-Stock

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315

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AZTECH Wire

Italy . 1,120 parts In-Stock

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$11.710

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Kulean Microsystems

USA . 6,919 parts In-Stock

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TANS Electronics

Latvia . 6,785 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,798 parts In-Stock

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SupplyDigital Components

Austria . 5,618 parts In-Stock

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Kepictronics

USA . 4,156 parts In-Stock

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Corphita

USA . 815 parts In-Stock

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Futuretech Components

Singapore . 699 parts In-Stock

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699

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Microchip USA

USA . 479 parts In-Stock

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UHIMA Technologies

Türkiye . 455 parts In-Stock

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Corohmni

South Africa . 381 parts In-Stock

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Vigor

Singapore . 366 parts In-Stock

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Problanco Electronics

Mexico . 249 parts In-Stock

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Overview

Discover the NCP1450ASN33T1 by Onsemi, a top-notch switching regulator & controller designed with precision and reliability in mind. Manufactured by Onsemi, a trusted industry leader, this product offers unparalleled quality and performance. Ideal for a variety of applications, this compact device provides efficient voltage regulation with minimal power loss. Experience the benefits of superior control and stability in your electronic projects with the NCP1450ASN33T1. Unlock new possibilities and achieve optimal results with this exceptional component.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount - YES

Surface mount design makes it easy to integrate into a variety of electronic devices.

Package Shape - RECTANGULAR

Rectangular shape allows for efficient use of space within the device.

No. of Terminals - 5

Having 5 terminals provides flexibility for connecting to various components in the system.

Maximum Operating Temperature - 85 °C

High maximum operating temperature ensures reliability even in challenging environmental conditions.

Control Mode - VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage for optimal performance.

Minimum Operating Temperature -40 °C

Low minimum operating temperature allows for use in a wide range of environments.

Terminal Finish - TIN LEAD

Tin lead terminal finish provides good conductivity and solderability.

Maximum Output Current - 0.15 A

Capable of delivering up to 0.15 A output current, suitable for a range of applications.

Control Technique - PULSE WIDTH MODULATION

Pulse width modulation control technique offers efficient power conversion with minimal losses.

Technical Specifications

Switching Regulators & Controllers NCP1450ASN33T1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

216 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.5 mm

Trade Compliance

NCP1450ASN33T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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