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NCP1450ASN30T1

Onsemi

NCP1450ASN30T1 by Onsemi

NCP1450ASN30T1 by Onsemi is a voltage-mode switching controller with a max output current of 0.15A and a max switching frequency of 216kHz. It operates in an industrial temperature range from -40 °C to 85°C, making it suitable for various applications requiring precise voltage regulation in compact spaces. The package style is small outline, thin profile, shrink pitch, with gull wing terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,267 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 400 parts In-Stock

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$14.590

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TANS Electronics

Latvia . 8,036 parts In-Stock

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SupplyDigital Components

Austria . 4,376 parts In-Stock

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Problanco Electronics

Mexico . 2,204 parts In-Stock

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Corphita

USA . 1,298 parts In-Stock

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Kulean Microsystems

USA . 778 parts In-Stock

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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Vigor

Singapore . 337 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 139 parts In-Stock

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Overview

Experience the superior quality and performance of the Onsemi NCP1450ASN30T1 Switching Regulator & Controller. Manufactured by Onsemi, a trusted name in the industry, this product offers reliable operation and precise control for a wide range of applications. With its compact design and advanced features, this switching regulator provides exceptional value and efficiency to customers. Whether you're looking to improve power management in industrial settings or enhance battery life in consumer electronics, the NCP1450ASN30T1 is the perfect solution for your needs. Elevate your projects with this top-of-the-line product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good heat dissipation and insulation, making the product reliable and durable.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the regulator to other components in the circuit.

Maximum Operating Temperature: 85 °C

High operating temperature range allows the regulator to be used in a variety of environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides stable and precise regulation of the output voltage.

Nominal Input Voltage: 5 V

Suitable nominal input voltage ensures compatibility with common power sources.

Maximum Output Current: 0.15 A

Capable of supplying up to 0.15A of current, making it suitable for low power applications.

Technical Specifications

Switching Regulators & Controllers NCP1450ASN30T1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

216 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.5 mm

Trade Compliance

NCP1450ASN30T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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