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NCP1410DMR2

Onsemi

NCP1410DMR2 by Onsemi

NCP1410DMR2 by Onsemi is a voltage-mode switching regulator with 1A output current, 600kHz max frequency, and boost switcher config. Ideal for industrial applications, it operates b/w -40 to 85 °C with input voltage range of 1-5.5V. This small outline IC in square package suits surface mount designs with dual terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,390 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,164 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 129 parts In-Stock

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$18.470

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Component Stockers USA

USA . 718 parts In-Stock

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$99.990

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Kepictronics

USA . 77,560 parts In-Stock

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SupplyDigital Components

Austria . 7,401 parts In-Stock

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TANS Electronics

Latvia . 7,331 parts In-Stock

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Kulean Microsystems

USA . 6,738 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,485 parts In-Stock

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Problanco Electronics

Mexico . 6,387 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 1,091 parts In-Stock

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Futuretech Components

Singapore . 699 parts In-Stock

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UHIMA Technologies

Türkiye . 629 parts In-Stock

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Vigor

Singapore . 250 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 158 parts In-Stock

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Overview

Discover the power and efficiency of the NCP1410DMR2 by Onsemi, a top-of-the-line switching regulator that delivers superior performance in a compact package. From the trusted manufacturer Onsemi, this product offers unparalleled reliability and precision for a wide range of applications. With its advanced control mode and high maximum output current, customers can enjoy seamless operation and optimized power management. Say goodbye to inefficiencies and hello to optimal performance with the NCP1410DMR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and durability, ensuring reliable performance.

Surface Mount: YES

SMT technology allows for easy assembly onto PCBs, saving space and labor costs.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates in extreme low temperature environments, increasing versatility.

Nominal Input Voltage: 3.3 V

Designed for applications requiring a stable input voltage of 3.3V.

Maximum Switching Frequency: 600 kHz

High switching frequency allows for efficient power conversion and regulation.

Maximum Output Current: 1 A

Capable of delivering high current output, suitable for various loads.

Technical Specifications

Switching Regulators & Controllers NCP1410DMR2 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE FREQUENCY MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

600 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

NCP1410DMR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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