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NCP1400ASN25T1G

Onsemi

NCP1400ASN25T1G by Onsemi

NCP1400ASN25T1G by Onsemi is a voltage-mode switching regulator with max output current of 0.4A and max switching frequency of 216kHz. It operates b/w -40 to 85 °C, ideal for industrial applications requiring boost switcher configuration in a small outline package.

Median Price

$13.670

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 19 parts In-Stock

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$13.670

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Digiode

USA . 1,794 parts In-Stock

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$12.986

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$12.986

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Vyrian

USA . 4,048 parts In-Stock

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Chip Stock

USA . 2,994 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 181 parts In-Stock

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$0.270

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AZTECH Wire

Italy . 941 parts In-Stock

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$10.350

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941

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Corphita

USA . 595 parts In-Stock

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$12.303

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595

$12.303

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Corohmni

South Africa . 254 parts In-Stock

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$13.670

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Component Stockers USA

USA . 222 parts In-Stock

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$99.990

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222

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Kulean Microsystems

USA . 7,989 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,902 parts In-Stock

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TANS Electronics

Latvia . 6,302 parts In-Stock

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Problanco Electronics

Mexico . 3,607 parts In-Stock

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Perfect Parts

USA . 3,508 parts In-Stock

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Microchip USA

USA . 3,338 parts In-Stock

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SupplyDigital Components

Austria . 1,945 parts In-Stock

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UHIMA Technologies

Türkiye . 722 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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700

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 19 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the NCP1400ASN25T1G by Onsemi, a cutting-edge switching regulator & controller that promises reliability and efficiency. Manufactured by Onsemi, a trusted name in the industry, this small outline, thin profile package offers superior performance in a variety of applications. With a maximum output current of 0.4A and voltage-mode control technique, this product ensures optimal power management for your projects. Say goodbye to overheating and inefficiency – choose the NCP1400ASN25T1G for seamless operation and enhanced functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the regulator to other components, enhancing versatility in design.

Maximum Switching Frequency: 216 kHz

High switching frequency allows for efficient power conversion, reducing energy loss and enhancing overall performance.

Maximum Output Current: 0.4 A

Capable of handling a maximum output current of 0.4 A, making it suitable for low power applications or as part of a larger system.

Technical Specifications

Switching Regulators & Controllers NCP1400ASN25T1G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5 V

Minimum Input Voltage:

.95 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

216 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP1400ASN25T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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