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NCP1377P

Onsemi

NCP1377P by Onsemi

NCP1377P by Onsemi is a current-mode switching controller with 300 kHz max frequency and 0.5 A output. With 11 V nominal input, it's ideal for applications requiring pulse width modulation control in compact designs. The IC features through-hole terminals, PLASTIC/EPOXY package material, and IN-LINE style for versatile usage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,232 parts In-Stock

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AZTECH Wire

Italy . 495 parts In-Stock

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TANS Electronics

Latvia . 8,042 parts In-Stock

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Problanco Electronics

Mexico . 3,648 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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Corphita

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SupplyDigital Components

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Microchip USA

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Corohmni

South Africa . 283 parts In-Stock

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Vigor

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Overview

Unlock the power of efficient energy management with the NCP1377P by Onsemi. This cutting-edge switching regulator and controller is crafted with precision using high-quality materials, ensuring optimal performance and reliability. Ideal for a wide range of applications, this innovative product offers customers exceptional value, benefits, and advantages. Say goodbye to energy waste and hello to cost savings with the NCP1377P from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good heat dissipation and electrical insulation, making the product reliable and durable.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement within electronic circuits.

No. of Terminals: 7

Having 7 terminals provides flexibility in connections and compatibility with various systems.

Control Mode: CURRENT-MODE

Current-mode control offers better performance and stability in regulating voltage outputs.

Maximum Output Current: 0.5 A

The product can handle a maximum output current of 0.5A, suitable for low to medium power applications.

Maximum Switching Frequency: 300 kHz

High switching frequency allows for efficient power conversion and reduced component size.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Control Technique: PULSE WIDTH MODULATION

PWM control technique enables precise regulation of output voltage with high efficiency.

Technical Specifications

Switching Regulators & Controllers NCP1377P attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.2 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDIP-T7

JESD-609 Code:

e0

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

300 kHz

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NCP1377P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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