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NCP1351BPG

Onsemi

NCP1351BPG by Onsemi

NCP1351BPG by Onsemi is a switching controller with current-mode control technique. It operates at a max switching frequency of 65 kHz and supports a peak output current of 0.4 A. This IC is commonly used in applications requiring pulse width modulation for power regulation in the voltage range of 9.5 V to 28 V.

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Lifecycle Status

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Vyrian

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AZTECH Wire

Italy . 674 parts In-Stock

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Component Stockers USA

USA . 606 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

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Microchip USA

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Overview

Enhance your power management systems with the NCP1351BPG switching regulator/controller by Onsemi. Designed with precision and reliability, this product offers unparalleled performance in a compact package. Ideal for a wide range of applications, from consumer electronics to industrial equipment, this efficient controller ensures optimal power delivery while minimizing energy consumption. Trust Onsemi's expertise and innovation to elevate your designs and streamline your projects. Experience the value and benefits of the NCP1351BPG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external factors, making the product reliable for long-term use.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the regulator or controller to other components, allowing for versatile applications and configurations.

Control Mode: CURRENT-MODE

Current-mode control offers better stability and reliability in regulating the output current, making the product suitable for applications that require precise current control.

Maximum Output Current: 0.4 A

With a maximum output current of 0.4 A, this switching regulator or controller can efficiently handle moderate to low power loads, making it ideal for various electronic devices.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation allows for efficient and accurate control of the output voltage, leading to better performance and energy efficiency in the system.

Technical Specifications

Switching Regulators & Controllers NCP1351BPG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

9.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

65 kHz

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NCP1351BPG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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