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NCP1288BD65R2G

Onsemi

NCP1288BD65R2G by Onsemi

NCP1288BD65R2G by Onsemi is a switching controller with current-mode control technique, operating b/w -40 to 125 °C. It has a single switcher configuration, supports input voltage range of 6.5-28V, and offers a max switching frequency of 70 kHz. Ideal for automotive applications due to its small outline package and pulse width modulation control mode.

Median Price

$0.849

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 887 parts In-Stock

1+ parts

-

100+ parts

$0.849

1k+ parts

$0.705

10k+ parts

$0.628

887

-

$0.849

$0.705

$0.628

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,913 parts In-Stock

1+ parts

$0.858

100+ parts

-

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1,913

$0.858

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Vyrian

USA . 3,917 parts In-Stock

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3,917

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Distributors (Availability)

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Corphita

USA . 2,197 parts In-Stock

1+ parts

$0.813

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-

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2,197

$0.813

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-

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Corohmni

South Africa . 207 parts In-Stock

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$0.903

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207

$0.903

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Vigor

Singapore . 885 parts In-Stock

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$1.560

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885

$1.560

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AZTECH Wire

Italy . 1,220 parts In-Stock

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$8.070

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$8.070

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Perfect Parts

USA . 110,589 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 5,474 parts In-Stock

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Kepictronics

USA . 5,044 parts In-Stock

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Problanco Electronics

Mexico . 4,803 parts In-Stock

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TANS Electronics

Latvia . 3,323 parts In-Stock

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SupplyDigital Components

Austria . 2,306 parts In-Stock

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RC Electronics

USA . 1,800 parts In-Stock

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Kulean Microsystems

USA . 1,728 parts In-Stock

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UHIMA Technologies

Türkiye . 791 parts In-Stock

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Microchip USA

USA . 210 parts In-Stock

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Overview

Enhance your power management systems with the NCP1288BD65R2G by Onsemi, a top-tier manufacturer known for their cutting-edge technology and reliability. This switching regulator and controller offers unparalleled efficiency and precision in a variety of applications. With a compact design and high temperature tolerance, this product ensures optimal performance under demanding conditions. Upgrade your projects with the value and benefits that only Onsemi can provide, and experience the advantages of superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments where temperature fluctuations may occur.

Control Mode: CURRENT-MODE

Current-mode control provides better dynamic response and stability compared to voltage-mode control, enhancing the performance of the product.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and ensures good electrical conductivity, contributing to the reliability of the product.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact design and easy integration into space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliable operation in automotive environments with temperature variations and vibrations.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides efficient power conversion and regulation, maximizing the product's energy efficiency.

Technical Specifications

Switching Regulators & Controllers NCP1288BD65R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

6.5 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP7/8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

70 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1288BD65R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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