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NCP1252APG

Onsemi

NCP1252APG by Onsemi

NCP1252APG by Onsemi is a switching controller with current-mode control technique, operating at a max frequency of 500 kHz. With a wide input voltage range from 9V to 28V, it is suitable for various applications requiring pulse width modulation in power electronics. The IC comes in an 8-terminal rectangular package with through-hole terminals and tin finish.

Median Price

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Lifecycle Status

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Bristol Electronics

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Ampacity Inc.

Singapore . 77 parts In-Stock

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Andel Nordic

Denmark . 1,488 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,183 parts In-Stock

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AZTECH Wire

Italy . 354 parts In-Stock

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Kulean Microsystems

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Overview

Unlock the potential of your electronic devices with the NCP1252APG switching regulator from Onsemi. Designed with precision and excellence, Onsemi is a trusted manufacturer known for delivering high-quality products. This versatile regulator offers unmatched performance and efficiency in a wide range of applications. Say goodbye to power supply issues and hello to seamless operation with the NCP1252APG. Trust Onsemi to provide you with the best solution for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability and easy handling of the product.

Control Mode: CURRENT-MODE

Current-mode control provides efficient regulation of output voltage by adjusting the current flowing through the regulator, resulting in improved transient response and stability.

Maximum Seated Height: 5.33 mm

The compact design with a maximum seated height of 5.33 mm allows for space-saving installation in tight or limited spaces, making it ideal for small-scale applications.

Maximum Switching Frequency: 500 kHz

The high maximum switching frequency of 500 kHz enables fast and precise regulation of output voltage, reducing ripple and achieving better overall performance.

Nominal Input Voltage: 15 V

The nominal input voltage of 15 V allows for compatibility with a wide range of power sources, providing flexibility in usage across various electronic devices or systems.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique facilitates accurate and efficient regulation of output voltage by adjusting the width of pulses, ensuring stable and reliable operation.

Technical Specifications

Switching Regulators & Controllers NCP1252APG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

9 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.59 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

500 kHz

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NCP1252APG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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