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NCP1230D165R2G

Onsemi

NCP1230D165R2G by Onsemi

NCP1230D165R2G by Onsemi is a current-mode switching controller with max output current of 0.5A and max operating temp of 125 °C. Ideal for automotive applications, it operates b/w -40 to 125°C, has a single switcher config, and uses pulse width modulation control technique.

Median Price

$0.866

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 19,834 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$0.850

10k+ parts

$0.754

19,834

-

$1.100

$0.850

$0.754

Farnell

UK . 19,822 parts In-Stock

1+ parts

-

100+ parts

$0.633

1k+ parts

$0.422

10k+ parts

-

19,822

-

$0.633

$0.422

-

Distributors (In-Stock)

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Digiode

USA . 2,474 parts In-Stock

1+ parts

$0.843

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2,474

$0.843

-

-

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Vyrian

USA . 4,529 parts In-Stock

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4,529

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Flip Electronics

USA . 1,238 parts In-Stock

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1,238

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Distributors (Availability)

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Corphita

USA . 984 parts In-Stock

1+ parts

$0.798

100+ parts

-

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984

$0.798

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-

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Corohmni

South Africa . 281 parts In-Stock

1+ parts

$0.887

100+ parts

-

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281

$0.887

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Vigor

Singapore . 930 parts In-Stock

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$1.120

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930

$1.120

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Continental Prestige Electronics

USA . 15,542 parts In-Stock

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$1.320

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15,542

$1.320

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Microchip USA

USA . 399 parts In-Stock

1+ parts

$3.833

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399

$3.833

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AZTECH Wire

Italy . 1,053 parts In-Stock

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$18.330

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1,053

$18.330

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Perfect Parts

USA . 7,007 parts In-Stock

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7,007

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SupplyDigital Components

Austria . 3,788 parts In-Stock

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3,788

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Kulean Microsystems

USA . 3,707 parts In-Stock

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Problanco Electronics

Mexico . 3,507 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 969 parts In-Stock

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969

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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236

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Discover the NCP1230D165R2G by Onsemi, a top-of-the-line switching regulator & controller that promises unparalleled quality and reliability. With Onsemi's reputation for cutting-edge technology, this product offers exceptional performance in various applications. From automotive to industrial settings, this small outline package delivers efficient control and pulse width modulation, ensuring optimal output current and voltage regulation. Experience the value and benefits of Onsemi's NCP1230D165R2G - your go-to solution for power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even under high temperature conditions.

Control Mode: CURRENT-MODE

Enables precise control of the current flow, leading to efficient power conversion.

Nominal Input Voltage: 13 V

Designed to operate effectively within a specific input voltage range, providing stable power output.

Maximum Output Current: 0.5 A

Capable of delivering sufficient current for powering various circuits or devices.

Control Technique: PULSE WIDTH MODULATION

Uses a widely adopted control method that helps in regulating the output voltage efficiently.

Minimum Input Voltage: 8.4 V

Allows the product to function even with lower input voltage levels for versatility in different applications.

Technical Specifications

Switching Regulators & Controllers NCP1230D165R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

PULSE FREQUENCY MODULATION TECHNIQUE IS ALSO POSSIBLE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

8.4 V

Nominal Input Voltage:

13 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

146 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1230D165R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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