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NCP1216D133R2G

Onsemi

NCP1216D133R2G by Onsemi

NCP1216D133R2G by Onsemi is a current-mode switching controller with a max output current of 0.5A and a max switching frequency of 146kHz. This CMOS technology-based device is ideal for applications requiring pulse width modulation control technique in small outline packages.

Median Price

$0.641

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96 parts In-Stock

1+ parts

$0.641

100+ parts

$0.603

1k+ parts

$0.545

10k+ parts

-

96

$0.641

$0.603

$0.545

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,887 parts In-Stock

1+ parts

$0.609

100+ parts

-

1k+ parts

-

10k+ parts

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1,887

$0.609

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Component Electronics Inc.

Canada . 1,385 parts In-Stock

1+ parts

$1.920

100+ parts

$1.440

1k+ parts

$1.250

10k+ parts

-

1,385

$1.920

$1.440

$1.250

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Quantum Digital Technology

USA . 5,954 parts In-Stock

1+ parts

-

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5,954

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Vyrian

USA . 5,252 parts In-Stock

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5,252

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Sensible Micro Corp

USA . 4,203 parts In-Stock

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4,203

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 747 parts In-Stock

1+ parts

$0.577

100+ parts

-

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747

$0.577

-

-

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Corohmni

South Africa . 137 parts In-Stock

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$0.641

100+ parts

-

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137

$0.641

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Vigor

Singapore . 400 parts In-Stock

1+ parts

$1.210

100+ parts

-

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400

$1.210

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$11.920

100+ parts

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515

$11.920

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Perfect Parts

USA . 96,488 parts In-Stock

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96,488

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Authorized Procurement Solutions

USA . 11,500 parts In-Stock

1+ parts

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100+ parts

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11,500

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GreenTree Electronics

Israel . 11,500 parts In-Stock

1+ parts

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11,500

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QUARKTWIN TECHNOLOGY LTD

USA . 10,738 parts In-Stock

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10,738

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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SupplyDigital Components

Austria . 7,397 parts In-Stock

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7,397

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Kulean Microsystems

USA . 5,078 parts In-Stock

1+ parts

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5,078

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TANS Electronics

Latvia . 3,752 parts In-Stock

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3,752

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Problanco Electronics

Mexico . 3,667 parts In-Stock

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3,667

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UHIMA Technologies

Türkiye . 897 parts In-Stock

1+ parts

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897

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Microchip USA

USA . 176 parts In-Stock

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176

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Overview

Discover the NCP1216D133R2G by Onsemi, a top-quality switching regulator and controller designed to deliver efficiency and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers superior performance and durability. Ideal for a wide range of applications, this product provides customers with value, benefits, and advantages that can't be beaten. Upgrade your projects with the NCP1216D133R2G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protect the internal components of the switching regulator, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces space requirements, making it suitable for compact designs and manufacturing efficiency.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for versatile integration with other components in a circuit.

Maximum Output Current: 0.5 A

The high maximum output current capability of 0.5 A makes this switching regulator suitable for powering a variety of electronic devices efficiently.

Maximum Switching Frequency: 146 kHz

The high switching frequency of 146 kHz enables fast response times and efficient power conversion, making it ideal for applications that require precise voltage regulation.

Technical Specifications

Switching Regulators & Controllers NCP1216D133R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

11 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

146 kHz

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1216D133R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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