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NCP1216AD100R2

Onsemi

NCP1216AD100R2 by Onsemi

NCP1216AD100R2 by Onsemi is a current-mode switching controller with max output current of 0.5A and max switching frequency of 110kHz. It is used in applications requiring pulse width modulation control technique, such as small outline switching regulators & controllers. Package style is small outline, surface mountable with dual terminals for easy installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,346 parts In-Stock

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Digiode

USA . 742 parts In-Stock

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742

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AZTECH Wire

Italy . 214 parts In-Stock

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$14.450

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214

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QUARKTWIN TECHNOLOGY LTD

USA . 15,324 parts In-Stock

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Kulean Microsystems

USA . 7,146 parts In-Stock

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TANS Electronics

Latvia . 6,272 parts In-Stock

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Problanco Electronics

Mexico . 3,008 parts In-Stock

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Corphita

USA . 2,047 parts In-Stock

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UHIMA Technologies

Türkiye . 940 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 401 parts In-Stock

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Vigor

Singapore . 335 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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Overview

Unlock a world of efficient power management with the NCP1216AD100R2 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This switching regulator & controller is perfect for a wide range of applications, offering customers seamless control and precision in their power systems. With a current-mode control mode and pulse width modulation technique, this product guarantees optimal performance and energy efficiency. Say goodbye to power fluctuations and hello to a stable, reliable power supply with the NCP1216AD100R2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during transportation or installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient space utilization on the PCB and makes it easier to integrate into different designs.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the regulator to other components in the circuit, allowing for customization and versatile applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact designs, ideal for applications with limited board space.

Control Mode: CURRENT-MODE

Current-mode control offers better transient response, improved stability, and higher efficiency compared to voltage-mode control, enhancing the overall performance of the regulator.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and reliability, ensuring secure connections and long-lasting performance of the product.

Maximum Output Current: 0.5 A

Capable of delivering a maximum output current of 0.5A, suitable for low power applications where efficiency and precision are crucial.

Technical Specifications

Switching Regulators & Controllers NCP1216AD100R2 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

11 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

110 kHz

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NCP1216AD100R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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