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NCP1203D60R2G

Onsemi

NCP1203D60R2G by Onsemi

NCP1203D60R2G by Onsemi is a switching controller with current-mode control technique. It operates in automotive temperature grade range from -40 to 125 °C, suitable for various applications. With a max output current of 0.25A and a switching frequency of 73kHz, it is ideal for compact designs requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 26,180 parts In-Stock

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Vyrian

USA . 5,335 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,389 parts In-Stock

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Digiode

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Vigor

Singapore . 288 parts In-Stock

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$0.350

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288

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Corohmni

South Africa . 125 parts In-Stock

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$0.590

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125

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Continental Prestige Electronics

USA . 773 parts In-Stock

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$0.650

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$0.500

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$0.348

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773

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AZTECH Wire

Italy . 614 parts In-Stock

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$15.250

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614

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$17.708

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$16.114

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$14.521

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RC Electronics

USA . 62,291 parts In-Stock

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Perfect Parts

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Kepictronics

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

Canada . 20,000 parts In-Stock

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SupplyDigital Components

Austria . 8,397 parts In-Stock

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Kulean Microsystems

USA . 6,421 parts In-Stock

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S.R.D Solutions

India . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,787 parts In-Stock

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Problanco Electronics

Mexico . 5,626 parts In-Stock

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Microchip USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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TANS Electronics

Latvia . 2,076 parts In-Stock

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Assy Fe

Spain . 1,500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,389 parts In-Stock

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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Corphita

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Overview

Experience superior performance and reliability with the NCP1203D60R2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge Switching Regulators & Controllers that are versatile and efficient. This product is ideal for various applications due to its compact design and advanced technology. With a focus on quality and innovation, Onsemi ensures that customers receive value and benefits that exceed expectations. Upgrade your electronics with the NCP1203D60R2G and enjoy the advantages of top-notch components that make a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and can withstand harsh environmental conditions, making the product resilient and reliable.

Surface Mount: YES

Surface mount design is space-saving and allows for easy assembly, making the product suitable for compact applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for multiple input/output configurations.

Control Mode: CURRENT-MODE

Current-mode control offers improved transient response and stability, enhancing the overall performance of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can operate reliably in a wide range of environments.

Nominal Input Voltage: 11 V

The nominal input voltage of 11 V is suitable for many applications, providing compatibility with a variety of power sources.

Maximum Output Current: 0.25 A

The maximum output current of 0.25 A allows the product to deliver sufficient power for low to medium power applications.

Maximum Switching Frequency: 73 kHz

A high maximum switching frequency of 73 kHz enables fast response times and efficient power conversion.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets stringent automotive industry standards for reliability and performance.

Technical Specifications

Switching Regulators & Controllers NCP1203D60R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.4 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

73 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1203D60R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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