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NCP1203D100R2G

Onsemi

NCP1203D100R2G by Onsemi

NCP1203D100R2G by Onsemi is a switching controller with current-mode control technique, operating at -40 to 125 °C. It has a max output current of 0.25A and operates at a max frequency of 115kHz. Ideal for automotive applications due to its small outline package style and CMOS technology.

Median Price

$1.464

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,566 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 824 parts In-Stock

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Bristol Electronics

USA . 824 parts In-Stock

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$1.464

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$1.286

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824

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$1.464

$1.286

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Dan-Mar Components

USA . 824 parts In-Stock

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Digiode

USA . 406 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 270 parts In-Stock

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$0.450

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270

$0.450

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AZTECH Wire

Italy . 1,032 parts In-Stock

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$10.640

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Component Stockers USA

USA . 723 parts In-Stock

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$99.990

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723

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Perfect Parts

USA . 47,981 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,834 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,215 parts In-Stock

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Kulean Microsystems

USA . 7,035 parts In-Stock

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SupplyDigital Components

Austria . 5,242 parts In-Stock

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TANS Electronics

Latvia . 5,194 parts In-Stock

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Problanco Electronics

Mexico . 4,415 parts In-Stock

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Andel Nordic

Denmark . 3,568 parts In-Stock

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Corphita

USA . 2,336 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Microchip USA

USA . 1,335 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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700

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UHIMA Technologies

Türkiye . 427 parts In-Stock

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427

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Experience superior performance and reliability with the NCP1203D100R2G by Onsemi. As a leading manufacturer in switching regulators & controllers, Onsemi ensures top-notch quality and innovation in their products. This versatile device is perfect for a wide range of applications, providing efficient power management solutions. With its current-mode control mode and pulse width modulation technology, customers can expect optimized performance and energy savings. Trust Onsemi to deliver exceptional value and benefits with the NCP1203D100R2G, making it the ideal choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the switching regulator.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and place on the circuit board.

No. of Terminals: 8

Having a sufficient number of terminals allows for versatile connectivity options with other components.

Control Mode: CURRENT-MODE

Current-mode control provides stable and efficient operation of the switching regulator.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this regulator suitable for a wide range of applications, including automotive use.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance even in extreme conditions.

Nominal Input Voltage: 11 V

The nominal input voltage of 11V makes this switching regulator compatible with various power sources.

Maximum Output Current: 0.25 A

The maximum output current of 0.25A allows for efficient power delivery to connected components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for switching regulators.

Technical Specifications

Switching Regulators & Controllers NCP1203D100R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.4 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

115 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1203D100R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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