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NCP1203D100R2

Onsemi

NCP1203D100R2 by Onsemi

NCP1203D100R2 by Onsemi is a switching controller with current-mode control technique, operating at -40 to 125 °C. It has a max output current of 0.25A and operates at a max frequency of 115kHz. Ideal for automotive applications due to its small outline package and pulse width modulation technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 24,600 parts In-Stock

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Vyrian

USA . 8,392 parts In-Stock

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Digiode

USA . 2,479 parts In-Stock

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R&J Components

USA . 1,885 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 600 parts In-Stock

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$0.200

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600

$0.200

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$17.213

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$15.664

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$14.115

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2,500

$17.213

$15.664

$14.115

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AZTECH Wire

Italy . 641 parts In-Stock

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$19.460

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641

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QUARKTWIN TECHNOLOGY LTD

USA . 6,246 parts In-Stock

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SupplyDigital Components

Austria . 5,107 parts In-Stock

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Kulean Microsystems

USA . 4,533 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,965 parts In-Stock

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Corphita

USA . 1,360 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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UHIMA Technologies

Türkiye . 616 parts In-Stock

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TANS Electronics

Latvia . 576 parts In-Stock

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Microchip USA

USA . 191 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of efficient energy conversion with the NCP1203D100R2 by Onsemi. Crafted with precision and expertise, this switching regulator & controller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers superior performance and functionality. Experience the value and benefits of cutting-edge technology with the NCP1203D100R2, providing customers with a competitive edge in their designs. Trust Onsemi to deliver innovation and excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy installation and efficient use of space on a PCB.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control offers precise regulation of output current, leading to better overall performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperature conditions.

Nominal Input Voltage: 11 V

Suitable nominal input voltage makes this product compatible with a variety of applications.

Maximum Switching Frequency: 115 kHz

High maximum switching frequency enables fast response and efficient operation of the switching regulator.

Maximum Output Current: 0.25 A

Decent maximum output current capacity makes this product suitable for low power applications.

Technical Specifications

Switching Regulators & Controllers NCP1203D100R2 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

115 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NCP1203D100R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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