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NCP11367BBDBYDBR2G

Onsemi

NCP11367BBDBYDBR2G by Onsemi

NCP11367BBDBYDBR2G by Onsemi is a switching controller with current-mode control technique. It operates b/w -40 to 125 °C, suitable for automotive applications. With a max input voltage of 28V and switching frequency of 153 kHz, it offers precise power regulation in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 41,000 parts In-Stock

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Vyrian

USA . 10,845 parts In-Stock

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Digiode

USA . 471 parts In-Stock

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471

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Vigor

Singapore . 256 parts In-Stock

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$0.580

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256

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AZTECH Wire

Italy . 587 parts In-Stock

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$9.800

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QUARKTWIN TECHNOLOGY LTD

USA . 18,174 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,214 parts In-Stock

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Microchip USA

USA . 3,842 parts In-Stock

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Problanco Electronics

Mexico . 3,692 parts In-Stock

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TANS Electronics

Latvia . 2,074 parts In-Stock

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SupplyDigital Components

Austria . 851 parts In-Stock

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Corphita

USA . 768 parts In-Stock

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UHIMA Technologies

Türkiye . 729 parts In-Stock

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Corohmni

South Africa . 279 parts In-Stock

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Overview

Discover the power of the NCP11367BBDBYDBR2G by Onsemi, a top-of-the-line switching regulator & controller that guarantees superior performance and reliability. Manufactured by industry leader Onsemi, this product is designed to exceed expectations in automotive applications with its small outline and high temperature grade. With a wide input voltage range and advanced control techniques, this sleek device delivers unparalleled efficiency and precision. Elevate your projects with the cutting-edge technology of the NCP11367BBDBYDBR2G and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection for the internal components of the regulator, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB, ideal for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB and easy incorporation into the overall design of the electronic system.

No. of Terminals: 14

Having 14 terminals provides versatility in connecting various input and output devices, making it suitable for different applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the regulator can withstand harsh environmental conditions without compromising performance.

Control Mode: CURRENT-MODE

Current-mode control offers superior transient response and stability, making the regulator efficient in regulating voltage levels.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the regulator to function reliably even in extremely cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves the overall reliability of the regulator in case one terminal fails.

Maximum Seated Height: 1.1 mm

Low seated height makes the regulator suitable for applications with limited vertical space, allowing for compact designs.

Width (mm): 4.4 mm

Narrow width enables easy integration into tight spaces on the PCB while maintaining a streamlined layout.

Other IC type: SWITCHING CONTROLLER

Switching controller IC offers precise control over the switching frequency, resulting in efficient power conversion and reduced energy loss.

Nominal Input Voltage: 12 V

With a nominal input voltage of 12V, the regulator is compatible with a wide range of power sources, making it versatile for different applications.

Length: 6.5 mm

Compact length allows for flexible placement on the PCB, saving valuable space in electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the regulator can withstand high temperatures commonly found in automotive environments, making it suitable for automotive applications.

Maximum Switching Frequency: 153 kHz

High maximum switching frequency enables fast response times and efficient power conversion, enhancing the overall performance of the regulator.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection to the PCB, preventing issues like solder joints from breaking during operation.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise regulation of output voltage, ensuring stable operation under varying load conditions.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for a high density of terminals on the regulator, enabling efficient connectivity with other electronic components on the PCB.

Minimum Input Voltage: 7 V

Low minimum input voltage requirement allows the regulator to operate with a wide range of power sources, making it versatile for various applications.

Maximum Input Voltage: 28 V

High maximum input voltage rating ensures the regulator can handle input voltages within a wide range, making it suitable for diverse power sources.

Technical Specifications

Switching Regulators & Controllers NCP11367BBDBYDBR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

7 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G14

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Maximum Switching Frequency:

153 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

NCP11367BBDBYDBR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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