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NCP1077ABP100G

Onsemi

NCP1077ABP100G by Onsemi

NCP1077ABP100G by Onsemi is a switching controller with 12V supply voltage, 110 kHz max frequency, and -40 to 125 °C operating temp. Ideal for automotive applications due to its current-mode control, pulse width modulation, and buck-boost configuration.

Median Price

$1.120

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 18 parts In-Stock

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$0.725

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Chip1Stop

Japan . 18 parts In-Stock

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$1.120

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DigiKey

USA . 247 parts In-Stock

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$2.010

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$1.205

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Flip Electronics (Authorized)

USA . 14,300 parts In-Stock

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Verical

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Digiode

USA . 1,498 parts In-Stock

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$0.681

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Flip Electronics

USA . 14,300 parts In-Stock

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Vyrian

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Corphita

USA . 2,103 parts In-Stock

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$0.645

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Corohmni

South Africa . 485 parts In-Stock

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$0.717

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Vigor

Singapore . 355 parts In-Stock

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$1.650

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Microchip USA

USA . 2,767 parts In-Stock

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$15.015

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 7,057 parts In-Stock

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Problanco Electronics

Mexico . 6,435 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 3,436 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 723 parts In-Stock

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SupplyDigital Components

Austria . 419 parts In-Stock

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iodParts Technologies Inc.

India . 100 parts In-Stock

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GreenTree Electronics

Israel . 100 parts In-Stock

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Overview

Unleash the power of efficiency and reliability with the NCP1077ABP100G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality and performance in their Switching Regulators & Controllers category. Ideal for automotive applications, this product offers customers unmatched value through its innovative design and advanced features. Say goodbye to inefficiency and hello to optimized performance with the NCP1077ABP100G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Nominal Supply Voltage (Vsup): 12 V

The 12 V nominal supply voltage allows compatibility with a wide range of applications and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh operating conditions.

Control Mode: CURRENT-MODE

The current-mode control mode provides precise and stable control over the switching regulator's output, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures functionality in cold environments.

Maximum Switching Frequency: 110 kHz

The high maximum switching frequency of 110 kHz allows for efficient power conversion and regulation.

Technology: MOS

The use of MOS technology ensures high efficiency and reliability in the switching regulator's operation.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides flexibility in adjusting the output voltage levels for various applications.

Switcher Config: BUCK-BOOST

The buck-boost switcher configuration allows for both step-up and step-down voltage regulation, making this product versatile for different power supply requirements.

Technical Specifications

Switching Regulators & Controllers NCP1077ABP100G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T7

Length:

9.32 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.45 mm

Maximum Supply Current (Isup):

15 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

110 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

NCP1077ABP100G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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