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NCP1053ST136T3G

Onsemi

NCP1053ST136T3G by Onsemi

NCP1053ST136T3G by Onsemi is a voltage-mode switching regulator with max output current of 2A, operating temp range -40 to 125 °C, and max switching frequency of 154kHz. Ideal for automotive applications due to its small outline package and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,732 parts In-Stock

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Flip Electronics

USA . 4,000 parts In-Stock

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Digiode

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Vigor

Singapore . 230 parts In-Stock

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$1.580

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AZTECH Wire

Italy . 104 parts In-Stock

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$20.430

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QUARKTWIN TECHNOLOGY LTD

USA . 15,825 parts In-Stock

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TANS Electronics

Latvia . 5,072 parts In-Stock

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Metaverse IC Inc.

Canada . 4,000 parts In-Stock

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Kulean Microsystems

USA . 3,923 parts In-Stock

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SupplyDigital Components

Austria . 2,713 parts In-Stock

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Problanco Electronics

Mexico . 2,529 parts In-Stock

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Kepictronics

USA . 1,768 parts In-Stock

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Corphita

USA . 1,156 parts In-Stock

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Corohmni

South Africa . 494 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 11 parts In-Stock

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Overview

Experience superior performance and reliability with the NCP1053ST136T3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge switching regulators and controllers that are ideal for a wide range of applications. This product offers exceptional value and benefits to customers, providing efficient power management and precise control. With its compact design and advanced features, the NCP1053ST136T3G is the perfect choice for automotive-grade applications where quality and performance are essential. Trust Onsemi to deliver the best in class products for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on a circuit board.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient space utilization on the circuit board.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and performance in various operating conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control ensures accurate and stable voltage regulation for the product.

Width (mm): 3.5 mm

Compact width allows for easy integration in tight spaces or crowded PCB layouts.

Nominal Input Voltage: 8 V

Suitable nominal input voltage for efficient power conversion and regulation.

Maximum Output Current: 2 A

High maximum output current capability for powering various loads or components.

Technical Specifications

Switching Regulators & Controllers NCP1053ST136T3G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

8.5 V

Minimum Input Voltage:

7.5 V

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

154 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

NCP1053ST136T3G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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