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NCP1050ST100T3G

Onsemi

NCP1050ST100T3G by Onsemi

NCP1050ST100T3G by Onsemi is a voltage-mode switching regulator with 2A output current, 113kHz max switching frequency, and -40 to 125 °C operating temp. Ideal for automotive applications due to its small outline package and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,022 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 3,515 parts In-Stock

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Digiode

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Vigor

Singapore . 614 parts In-Stock

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$0.610

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AZTECH Wire

Italy . 992 parts In-Stock

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$10.280

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Perfect Parts

USA . 22,770 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

Austria . 7,776 parts In-Stock

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TANS Electronics

Latvia . 6,929 parts In-Stock

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Kulean Microsystems

USA . 6,669 parts In-Stock

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Kepictronics

USA . 5,053 parts In-Stock

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Problanco Electronics

Mexico . 2,773 parts In-Stock

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Corphita

USA . 2,086 parts In-Stock

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Microchip USA

USA . 481 parts In-Stock

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UHIMA Technologies

Türkiye . 429 parts In-Stock

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Corohmni

South Africa . 392 parts In-Stock

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Overview

Experience superior performance and reliability with the NCP1050ST100T3G by Onsemi. As a leading manufacturer in switching regulators & controllers, Onsemi delivers top-quality products that cater to various applications. The NCP1050ST100T3G stands out for its efficiency, durability, and versatility, making it an ideal choice for automotive and industrial systems. With a compact design and advanced control mode, this switching regulator ensures optimal power management and seamless operation. Trust Onsemi's expertise and elevate your projects with the NCP1050ST100T3G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board, optimizing space usage.

No. of Terminals: 4

Having 4 terminals provides flexibility for connecting to external components and peripherals.

Control Mode: VOLTAGE-MODE

The voltage-mode control technique offers stable and efficient regulation of the output voltage, ensuring reliable performance.

Maximum Output Current: 2 A

With a high maximum output current of 2 A, this product can handle demanding power requirements in various applications.

Technical Specifications

Switching Regulators & Controllers NCP1050ST100T3G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

8.5 V

Minimum Input Voltage:

7.5 V

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

113 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

NCP1050ST100T3G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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