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NCP1030DMR2G

Onsemi

NCP1030DMR2G by Onsemi

NCP1030DMR2G by Onsemi is a VOLTAGE-MODE switching regulator with 8 terminals, operating b/w -40 to 125 °C. It has a max output current of 0.68 A and supports PULSE WIDTH MODULATION control technique. Ideal for automotive applications due to its small size, boost configuration, and high switching frequency of 1000 kHz.

Median Price

$1.425

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.160

10k+ parts

$1.040

54,000

-

$1.400

$1.160

$1.040

Verical

USA . 34,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.450

10k+ parts

$1.300

34,000

-

-

$1.450

$1.300

Distributors (In-Stock)

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 5,036 parts In-Stock

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5,036

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Inventory MP

USA . 2,224 parts In-Stock

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2,224

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Bristol Electronics

USA . 2,224 parts In-Stock

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2,224

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Digiode

USA . 710 parts In-Stock

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710

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Distributors (Availability)

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Corohmni

South Africa . 479 parts In-Stock

1+ parts

$0.735

100+ parts

-

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479

$0.735

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Ampacity Inc.

Singapore . 27,950 parts In-Stock

1+ parts

$0.970

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27,950

$0.970

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AZTECH Wire

Italy . 1,147 parts In-Stock

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$8.720

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$8.720

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Perfect Parts

USA . 44,755 parts In-Stock

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44,755

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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SupplyDigital Components

Austria . 8,215 parts In-Stock

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Kepictronics

USA . 7,088 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,281 parts In-Stock

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Problanco Electronics

Mexico . 3,877 parts In-Stock

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Kulean Microsystems

USA . 3,480 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,467 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,751 parts In-Stock

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Corphita

USA . 1,044 parts In-Stock

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UHIMA Technologies

Türkiye . 958 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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Overview

Discover the power of reliable and efficient performance with the NCP1030DMR2G from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and innovation in their Switching Regulators & Controllers. Ideal for automotive applications, this small outline, thin profile package offers customers the value of increased efficiency and precision control. Experience the benefits of voltage-mode control and pulse width modulation, providing a seamless boost in performance for your electronic devices. Upgrade your systems with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the sensitive components inside the switching regulator, making it reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this switching regulator can withstand harsh environmental conditions and ensure consistent performance even in demanding applications.

Nominal Input Voltage: 12 V

The 12V nominal input voltage makes this switching regulator suitable for a wide range of electronic devices and systems that operate within this voltage range.

Maximum Output Current: 0.68 A

The 0.68A maximum output current capability allows this switching regulator to efficiently power various components in a circuit, making it versatile and reliable.

Technical Specifications

Switching Regulators & Controllers NCP1030DMR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.68 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NCP1030DMR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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