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NCP1015ST65T3G

Onsemi

NCP1015ST65T3G by Onsemi

NCP1015ST65T3G by Onsemi is a small outline switching regulator with 1A output current and 71kHz max frequency. Ideal for applications requiring pulse width modulation control technique in compact spaces.

Median Price

$0.801

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$0.786

1k+ parts

$0.653

10k+ parts

$0.582

36,000

-

$0.786

$0.653

$0.582

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.816

10k+ parts

$0.727

36,000

-

-

$0.816

$0.727

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 56,000 parts In-Stock

1+ parts

-

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-

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-

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56,000

-

-

-

-

Cyclops Electronics Ltd

UK . 8,000 parts In-Stock

1+ parts

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-

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8,000

-

-

-

-

Vyrian

USA . 5,436 parts In-Stock

1+ parts

-

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-

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5,436

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-

-

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Digiode

USA . 359 parts In-Stock

1+ parts

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-

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359

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-

Distributors (Availability)

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AZTECH Wire

Italy . 1,058 parts In-Stock

1+ parts

$18.010

100+ parts

-

1k+ parts

-

10k+ parts

-

1,058

$18.010

-

-

-

Perfect Parts

USA . 35,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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35,896

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Kepictronics

USA . 24,000 parts In-Stock

1+ parts

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24,000

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-

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Problanco Electronics

Mexico . 8,363 parts In-Stock

1+ parts

-

100+ parts

-

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8,363

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A-Z Elektronik GmbH

Germany . 6,383 parts In-Stock

1+ parts

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6,383

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SupplyDigital Components

Austria . 5,259 parts In-Stock

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5,259

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TANS Electronics

Latvia . 4,453 parts In-Stock

1+ parts

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4,453

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

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Kulean Microsystems

USA . 1,348 parts In-Stock

1+ parts

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1,348

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UHIMA Technologies

Türkiye . 496 parts In-Stock

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496

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Corphita

USA . 457 parts In-Stock

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457

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Corohmni

South Africa . 428 parts In-Stock

1+ parts

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428

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Microchip USA

USA . 115 parts In-Stock

1+ parts

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115

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Overview

Unlock the power of efficient energy management with the NCP1015ST65T3G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This switching regulator offers unrivaled performance in a range of applications, providing customers with superior value and benefits. With current-mode control mode and pulse width modulation technique, this product ensures optimal power conversion and regulation. Say goodbye to energy wastage and hello to cost-effective solutions with the NCP1015ST65T3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and ensures reliability of the product.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape helps in space-saving and efficient placement on the PCB.

No. of Terminals: 4

Having 4 terminals provides stable connections and ensures proper functioning of the regulator.

Package Style: SMALL OUTLINE

Small outline package style allows for compact design and integration in various applications.

Control Mode: CURRENT-MODE

Current-mode control offers better load regulation and transient response for enhanced performance.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and improves solderability for a longer product lifespan.

Maximum Seated Height: 1.75 mm

Low seated height enables the product to be used in space-constrained applications.

Maximum Output Current: 1 A

With a maximum output current of 1 A, this product can support a variety of loads efficiently.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers precise control over the output voltage, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers NCP1015ST65T3G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

71 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

NCP1015ST65T3G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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