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NCP1014ST100T3

Onsemi

NCP1014ST100T3 by Onsemi

NCP1014ST100T3 by Onsemi is a small outline switching regulator with 1A output current, 110kHz max frequency, and 8V nominal input voltage. Ideal for applications requiring pulse width modulation control technique in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 8,500 parts In-Stock

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Digiode

USA . 1,365 parts In-Stock

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Vyrian

USA . 425 parts In-Stock

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425

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AZTECH Wire

Italy . 1,181 parts In-Stock

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$11.580

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SupplyDigital Components

Austria . 6,417 parts In-Stock

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Problanco Electronics

Mexico . 5,598 parts In-Stock

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Kulean Microsystems

USA . 4,647 parts In-Stock

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Corphita

USA . 617 parts In-Stock

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UHIMA Technologies

Türkiye . 612 parts In-Stock

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TANS Electronics

Latvia . 504 parts In-Stock

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Microchip USA

USA . 421 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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Overview

Enhance your power management solutions with the NCP1014ST100T3 by Onsemi, a top-tier manufacturer in the field of Switching Regulators & Controllers. This compact and efficient device offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its current-mode control mode and pulse width modulation technique, this switching regulator ensures optimal power efficiency and stability. Experience the value and benefits of this innovative product, designed to meet your power management needs with precision and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability to the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and space-saving design, ideal for applications where space is limited.

No. of Terminals: 4

Having 4 terminals allows for simple and straightforward connections, minimizing the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

Small outline package style is suitable for designs where size constraints are critical, making this product versatile and adaptable.

Control Mode: CURRENT-MODE

Current-mode control offers stable and efficient regulation of the output voltage, ensuring consistent performance under varying load conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and conductivity, enhancing the overall reliability and performance of the product.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and reduces the complexity of the circuit design, making it user-friendly.

Maximum Seated Height: 1.75 mm

Low seated height allows for a more compact and space-efficient design, suitable for applications with height restrictions.

Width (mm): 3.5 mm

With a width of 3.5mm, this product can fit into tight spaces and compact designs, making it a versatile choice for various applications.

Other IC type: SWITCHING REGULATOR

Being a switching regulator, this product offers high efficiency and precise voltage regulation, making it a reliable choice for power management applications.

Nominal Input Voltage: 8 V

With a nominal input voltage of 8V, this product is suitable for a wide range of applications requiring a stable input voltage.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235 °C ensures that the product can withstand the soldering process without any damage, ensuring a reliable and robust assembly.

Length: 6.5 mm

Compact length of 6.5mm makes this product suitable for applications where space is limited, providing flexibility in design.

Maximum Switching Frequency: 110 kHz

High maximum switching frequency of 110kHz allows for efficient control and regulation of the output voltage, ensuring stable performance under varying load conditions.

Maximum Output Current: 1 A

With a maximum output current of 1A, this product can handle a variety of loads, making it versatile for different applications requiring different current ratings.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and ease of soldering, ensuring a reliable electrical connection and robust assembly.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers efficient and accurate regulation of the output voltage, providing stable performance under varying conditions.

Switcher Config: SINGLE

Single switcher configuration simplifies the design and operation of the product, making it user-friendly and easy to integrate into different systems.

Terminal Pitch: 2.3 mm

With a terminal pitch of 2.3mm, this product offers easy and convenient connections, reducing the chances of errors during installation and improving overall reliability.

Technical Specifications

Switching Regulators & Controllers NCP1014ST100T3 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e0

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

110 kHz

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

SINGLE

Width (mm):

3.5 mm

Trade Compliance

NCP1014ST100T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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