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NCP1014APL100R2G

Onsemi

NCP1014APL100R2G by Onsemi

NCP1014APL100R2G by Onsemi is a current-mode switching regulator with 1A output current and 110kHz max switching frequency. It features pulse width modulation control technique, suitable for applications requiring small outline package style and surface mount compatibility.

Median Price

$2.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 498 parts In-Stock

1+ parts

$2.690

100+ parts

$2.020

1k+ parts

$1.750

10k+ parts

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498

$2.690

$2.020

$1.750

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Vyrian

USA . 4,206 parts In-Stock

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Digiode

USA . 1,887 parts In-Stock

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1,887

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Infinite Electronics LLP

India . 601 parts In-Stock

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601

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Distributors (Availability)

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Corohmni

South Africa . 76 parts In-Stock

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$2.690

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76

$2.690

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AZTECH Wire

Italy . 500 parts In-Stock

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$9.150

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500

$9.150

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TANS Electronics

Latvia . 6,846 parts In-Stock

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6,846

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Kulean Microsystems

USA . 5,052 parts In-Stock

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5,052

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Problanco Electronics

Mexico . 2,586 parts In-Stock

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2,586

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SupplyDigital Components

Austria . 1,534 parts In-Stock

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1,534

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Corphita

USA . 888 parts In-Stock

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888

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Microchip USA

USA . 477 parts In-Stock

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477

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UHIMA Technologies

Türkiye . 455 parts In-Stock

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455

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Overview

Discover the NCP1014APL100R2G by Onsemi, a cutting-edge switching regulator that guarantees top-notch quality and performance. Manufactured by Onsemi, a trusted industry leader, this product is designed to meet the highest standards of excellence. Ideal for a wide range of applications, this switching regulator offers unparalleled value, benefits, and advantages to customers. Experience seamless control, efficient power management, and reliable operation with the NCP1014APL100R2G. Trust in Onsemi to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard PCB layouts and mounting options.

No. of Terminals: 7

Having 7 terminals provides flexibility in connection options and allows for customization in circuit design.

Control Mode: CURRENT-MODE

Current-mode control provides precise regulation and stability in output current, resulting in efficient power management.

Maximum Output Current: 1 A

Capable of delivering up to 1A output current, suitable for a wide range of electronic devices and applications.

Maximum Switching Frequency: 110 kHz

High switching frequency allows for fast response time and efficient power conversion, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers NCP1014APL100R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e3

Length:

9.525 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.1148 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

110 kHz

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

6.35 mm

Trade Compliance

NCP1014APL100R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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