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NCP1013ST130T3G

Onsemi

NCP1013ST130T3G by Onsemi

NCP1013ST130T3G by Onsemi is a small outline switching regulator with 1A output current and 143kHz max switching frequency. It operates at 8V input voltage, uses pulse width modulation control technique, and is ideal for applications requiring efficient power management in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 18,400 parts In-Stock

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Vyrian

USA . 5,691 parts In-Stock

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5,691

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Sensible Micro Corp

USA . 2,335 parts In-Stock

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Digiode

USA . 1,549 parts In-Stock

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1,549

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Contempo Components LLC

USA . 555 parts In-Stock

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555

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Cyclops Electronics Ltd

UK . 51 parts In-Stock

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51

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,186 parts In-Stock

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$3.500

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$3.500

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AZTECH Wire

Italy . 662 parts In-Stock

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$16.580

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662

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Perfect Parts

USA . 62,548 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,846 parts In-Stock

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Lixinc

USA . 12,797 parts In-Stock

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RC Electronics

USA . 9,500 parts In-Stock

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Kulean Microsystems

USA . 8,255 parts In-Stock

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Problanco Electronics

Mexico . 7,735 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 1,746 parts In-Stock

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SupplyDigital Components

Austria . 1,388 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 760 parts In-Stock

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760

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Corphita

USA . 643 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Overview

Boost your power management solutions with the NCP1013ST130T3G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their products. This switching regulator is perfect for a wide range of applications, offering efficient performance and optimal power control. With its small outline package and current-mode control mode, this regulator provides customers with convenience and ease of use. Say goodbye to power interruptions and hello to seamless power management with the NCP1013ST130T3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space in the design.

Package Shape: RECTANGULAR

Rectangular shape enables a compact and space-saving design, fitting well within modern electronic devices.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting the regulator within the circuit, allowing for various configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes the footprint of the product, ideal for space-constrained applications.

Control Mode: CURRENT-MODE

Current-mode control offers precise regulation of the output current, ensuring stable performance across different load conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides reliable electrical connections and solderability, enhancing the overall quality of the product.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and reduces the likelihood of errors during installation.

Maximum Seated Height: 1.75 mm

Low seated height allows for a more compact overall design, beneficial for applications with limited vertical space.

Width (mm): 3.5 mm

Narrow width enables the product to fit in tight spaces, making it suitable for compact electronic devices.

Other IC type: SWITCHING REGULATOR

Being a switching regulator type, this product offers high efficiency and low power dissipation, making it energy-efficient and cost-effective.

Nominal Input Voltage: 8 V

Operating at a nominal input voltage of 8V, this product is compatible with a wide range of power sources, providing versatility in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product can withstand high-temperature soldering processes, ensuring reliable connections during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of up to 260°C, this product can endure harsh soldering conditions without compromising its performance.

Length: 6.5 mm

Compact length allows for easy integration into various electronic designs while maintaining a sleek and space-efficient form factor.

Maximum Switching Frequency: 143 kHz

High switching frequency of 143 kHz enables efficient power conversion, reducing ripple and noise while enhancing overall system performance.

Maximum Output Current: 1 A

Capable of delivering a maximum output current of 1A, this product is suitable for powering a wide range of electronic components and devices.

Terminal Form: GULL WING

Gull wing terminal form offers secure mechanical support and facilitates easy soldering, ensuring reliable electrical connections.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise regulation of the output voltage, ensuring stable and efficient power delivery to the load.

Switcher Config: SINGLE

Single switcher configuration simplifies the design and implementation of the switching regulator, enhancing reliability and performance.

Terminal Pitch: 2.3 mm

With a terminal pitch of 2.3mm, this product offers easy connectivity and compatibility with standard PCB layouts, simplifying the assembly process.

Technical Specifications

Switching Regulators & Controllers NCP1013ST130T3G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

143 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

NCP1013ST130T3G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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