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NCP1013ST130T3

Onsemi

NCP1013ST130T3 by Onsemi

NCP1013ST130T3 by Onsemi is a small outline switching regulator with a max output current of 1A and a max switching frequency of 143kHz. It operates in current-mode control technique, suitable for applications requiring efficient power conversion in compact spaces. The package style is rectangular, surface mountable, with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,146 parts In-Stock

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Digiode

USA . 752 parts In-Stock

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752

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AZTECH Wire

Italy . 504 parts In-Stock

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$13.770

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QUARKTWIN TECHNOLOGY LTD

USA . 16,990 parts In-Stock

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Problanco Electronics

Mexico . 8,162 parts In-Stock

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SupplyDigital Components

Austria . 7,907 parts In-Stock

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Kulean Microsystems

USA . 5,844 parts In-Stock

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TANS Electronics

Latvia . 4,902 parts In-Stock

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Corphita

USA . 1,720 parts In-Stock

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 71 parts In-Stock

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Overview

Discover the power of the NCP1013ST130T3 by Onsemi, a top-of-the-line switching regulator & controller designed for efficiency and performance. Manufactured by Onsemi, a trusted leader in the industry, this product offers unparalleled quality and reliability. With a compact design and current-mode control mode, this device is perfect for a variety of applications. Whether you're looking to optimize your power management system or improve overall functionality, the NCP1013ST130T3 delivers unmatched value, benefits, and advantages to customers. Experience cutting-edge technology with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

No. of Terminals: 4

Simple design with fewer terminals makes the product easier to integrate and reduces chances of errors during installation.

Maximum Output Current: 1 A

Capable of delivering a decent amount of current, suitable for various applications without overloading.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique that helps regulate the output voltage accurately and efficiently.

Technical Specifications

Switching Regulators & Controllers NCP1013ST130T3 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e0

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

143 kHz

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

SINGLE

Width (mm):

3.5 mm

Trade Compliance

NCP1013ST130T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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