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NCP1012APL130R2G

Onsemi

NCP1012APL130R2G by Onsemi

NCP1012APL130R2G by Onsemi is a current-mode switching regulator with 1A output current and 143kHz max switching frequency. It is used in applications requiring pulse width modulation control technique, such as power supplies and voltage converters. The IC comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

$0.606

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,214 parts In-Stock

1+ parts

-

100+ parts

$0.595

1k+ parts

$0.493

10k+ parts

$0.440

1,214

-

$0.595

$0.493

$0.440

Verical

USA . 1,214 parts In-Stock

1+ parts

-

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-

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$0.617

10k+ parts

$0.550

1,214

-

-

$0.617

$0.550

Distributors (In-Stock)

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Digiode

USA . 193 parts In-Stock

1+ parts

$0.463

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193

$0.463

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ComSIT Distribution GmbH

Germany . 12,080 parts In-Stock

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Vyrian

USA . 3,803 parts In-Stock

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3,803

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LIBRA Elektronik GmbH

Germany . 1,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,128 parts In-Stock

1+ parts

$0.438

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2,128

$0.438

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Corohmni

South Africa . 165 parts In-Stock

1+ parts

$0.487

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165

$0.487

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AZTECH Wire

Italy . 944 parts In-Stock

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$17.890

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944

$17.890

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QUARKTWIN TECHNOLOGY LTD

USA . 26,838 parts In-Stock

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Problanco Electronics

Mexico . 5,280 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,401 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Kulean Microsystems

USA . 1,251 parts In-Stock

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Continental Prestige Electronics

USA . 1,214 parts In-Stock

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$0.436

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1,214

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$0.436

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Futuretech Components

Singapore . 700 parts In-Stock

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700

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UHIMA Technologies

Türkiye . 540 parts In-Stock

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540

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Microchip USA

USA . 395 parts In-Stock

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395

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TANS Electronics

Latvia . 207 parts In-Stock

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207

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Perfect Parts

USA . 54 parts In-Stock

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Overview

Discover the NCP1012APL130R2G by Onsemi, a top-quality switching regulator designed to meet your power management needs. With a small outline package and versatile current-mode control mode, this product offers superior performance and reliability. Whether you're working on consumer electronics, automotive systems, or industrial applications, this Onsemi regulator ensures efficient power delivery and enhances overall system performance. Trust Onsemi's expertise in power management solutions and experience the value and benefits of the NCP1012APL130R2G in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and thermal stability, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

No. of Terminals: 7

Having 7 terminals allows for versatile connectivity options and the potential to interface with multiple components.

Control Mode: CURRENT-MODE

Current-mode control provides enhanced efficiency and transient response in regulating the output voltage, ensuring stable performance.

Width (mm): 6.35 mm

Compact width of 6.35mm enables space-saving design and integration into tight layouts or small electronic devices.

Nominal Input Voltage: 8 V

Operating with a nominal input voltage of 8V allows compatibility with various power sources and flexibility in application scenarios.

Maximum Output Current: 1 A

Capable of handling a maximum output current of 1A, ensuring sufficient power delivery for a range of devices and circuits.

Technical Specifications

Switching Regulators & Controllers NCP1012APL130R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e3

Length:

9.525 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.1148 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

143 kHz

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

6.35 mm

Trade Compliance

NCP1012APL130R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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