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NCP1011ST65T3G

Onsemi

NCP1011ST65T3G by Onsemi

NCP1011ST65T3G by Onsemi is a small outline switching regulator with 4 terminals, operating at 71 kHz frequency and supporting 0.55 A output current. It uses pulse width modulation control technique for applications requiring efficient power management in compact spaces.

Median Price

$0.547

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,078 parts In-Stock

1+ parts

$0.547

100+ parts

$0.514

1k+ parts

$0.465

10k+ parts

-

3,078

$0.547

$0.514

$0.465

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,623 parts In-Stock

1+ parts

$0.520

100+ parts

-

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1,623

$0.520

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Flip Electronics

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Vyrian

USA . 1,996 parts In-Stock

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1,996

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J2 Sourcing AB

Sweden . 1,282 parts In-Stock

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1,282

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Distributors (Availability)

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Corphita

USA . 2,019 parts In-Stock

1+ parts

$0.492

100+ parts

-

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2,019

$0.492

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Corohmni

South Africa . 474 parts In-Stock

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$0.547

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474

$0.547

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AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$17.360

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740

$17.360

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Metaverse IC Inc.

Canada . 88,168 parts In-Stock

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88,168

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RC Electronics

USA . 24,300 parts In-Stock

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24,300

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Kepictronics

USA . 24,000 parts In-Stock

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24,000

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QUARKTWIN TECHNOLOGY LTD

USA . 23,461 parts In-Stock

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23,461

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Perfect Parts

USA . 16,756 parts In-Stock

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16,756

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Microchip USA

USA . 5,830 parts In-Stock

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5,830

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TANS Electronics

Latvia . 1,962 parts In-Stock

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1,962

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SupplyDigital Components

Austria . 1,877 parts In-Stock

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1,877

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Kulean Microsystems

USA . 1,861 parts In-Stock

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1,861

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Futuretech Components

Singapore . 700 parts In-Stock

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700

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Problanco Electronics

Mexico . 381 parts In-Stock

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381

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UHIMA Technologies

Türkiye . 23 parts In-Stock

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23

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Overview

Unlock the power of efficient energy management with the NCP1011ST65T3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Switching Regulators & Controllers. This innovative product offers customers the advantage of precise control and regulation, making it ideal for a wide range of applications. Experience the value of increased efficiency, reduced power consumption, and improved performance with the NCP1011ST65T3G. Elevate your projects with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving space and making the product suitable for compact designs.

Package Shape: RECTANGULAR

Rectangular shape provides versatility in placement and mounting options, fitting well within various electronic designs.

No. of Terminals: 4

Simplifies the connection process and enhances reliability in the electrical connections of the device.

Control Mode: CURRENT-MODE

Current-mode control offers better transient response and stability in regulating output voltage, improving overall performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring proper electrical connections during assembly.

Maximum Seated Height: 1.75 mm

Low seated height allows for a compact design and efficient use of space in electronic applications.

Width (mm): 3.5 mm

Narrow width enables the product to be incorporated into small form factor devices without sacrificing functionality.

Other IC type: SWITCHING REGULATOR

Switching regulator design offers high efficiency and precise voltage regulation, making it an energy-efficient choice for power management.

Nominal Input Voltage: 8 V

Suitable for handling a wide range of input voltages, providing flexibility in different power supply applications.

Maximum Switching Frequency: 71 kHz

High switching frequency allows for quick response times and efficient power delivery, enhancing the performance of the product.

Maximum Output Current: 0.55 A

Capable of delivering a moderate output current, making it suitable for powering various electronic components and subsystems.

Control Technique: PULSE WIDTH MODULATION

PWM control technique offers precise control over the output voltage, ensuring stable and accurate power delivery to connected devices.

Switcher Config: SINGLE

Single switcher configuration simplifies the design and control process, making the product easier to integrate into electronic systems.

Terminal Pitch: 2.3 mm

Optimal terminal pitch facilitates easy soldering and connection of external components, enhancing the reliability and robustness of the product.

Technical Specifications

Switching Regulators & Controllers NCP1011ST65T3G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Output Current:

.55 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

71 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

NCP1011ST65T3G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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