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NCP1011AP130G

Onsemi

NCP1011AP130G by Onsemi

NCP1011AP130G by Onsemi is a switching regulator with 7 terminals, 143 kHz max frequency, and 0.55 A output current. It uses pulse width modulation control technique for applications requiring efficient power conversion in compact spaces.

Median Price

$0.617

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 47,250 parts In-Stock

1+ parts

-

100+ parts

$0.617

1k+ parts

$0.512

10k+ parts

$0.457

47,250

-

$0.617

$0.512

$0.457

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 142 parts In-Stock

1+ parts

$0.504

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-

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142

$0.504

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Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

$1.125

100+ parts

$0.450

1k+ parts

$0.315

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-

1,000

$1.125

$0.450

$0.315

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Vyrian

USA . 8,358 parts In-Stock

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8,358

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ACDS - Activité Composants Distribution Service

France . 1,900 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 1,537 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,050 parts In-Stock

1+ parts

$0.477

100+ parts

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2,050

$0.477

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Corohmni

South Africa . 294 parts In-Stock

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$0.530

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294

$0.530

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AZTECH Wire

Italy . 1,202 parts In-Stock

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$9.350

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1,202

$9.350

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QUARKTWIN TECHNOLOGY LTD

USA . 10,728 parts In-Stock

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SupplyDigital Components

Austria . 8,361 parts In-Stock

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8,361

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Kulean Microsystems

USA . 5,948 parts In-Stock

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Microchip USA

USA . 4,618 parts In-Stock

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Perfect Parts

USA . 4,256 parts In-Stock

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Problanco Electronics

Mexico . 2,835 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,900 parts In-Stock

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1,900

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TANS Electronics

Latvia . 1,672 parts In-Stock

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1,672

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Assy Fe

Spain . 1,537 parts In-Stock

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Glotronic Ltd.

UK . 1,520 parts In-Stock

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1,520

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Metaverse IC Inc.

Canada . 980 parts In-Stock

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980

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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486

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Overview

Experience the superior quality and reliable performance of the NCP1011AP130G by Onsemi, a leading manufacturer in the field of Switching Regulators & Controllers. This innovative product offers a wide range of applications, providing efficient power management solutions for various electronic devices. With its compact design and advanced features like current-mode control and pulse width modulation, this switching regulator delivers exceptional value, ensuring optimal performance and energy efficiency. Upgrade your products with the NCP1011AP130G and experience the benefits of top-notch technology and unparalleled reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and efficient use of space.

No. of Terminals: 7

Having 7 terminals provides flexibility in connecting the regulator to other components, enabling versatile circuit configurations.

Control Mode: CURRENT-MODE

Current mode control offers better dynamic response and stability, making the regulator more reliable in various operating conditions.

Maximum Output Current: 0.55 A

With a maximum output current of 0.55 A, this regulator can handle moderate power demands, suitable for a range of electronic devices.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides efficient power conversion with minimal loss, contributing to overall energy efficiency of the product.

Technical Specifications

Switching Regulators & Controllers NCP1011AP130G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDIP-T7

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Output Current:

.55 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

143 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.62 mm

Trade Compliance

NCP1011AP130G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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