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NCN6010DTBR2G

Onsemi

NCN6010DTBR2G by Onsemi

The Onsemi NCN6010DTBR2G is a Power Management IC with 14 terminals, suitable for power supply support circuits. It operates b/w -25°C to 85°C, with a nominal voltage of 3V and supports multiple power supplies (3/3.3V, 3/5V). Ideal for surface mount applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,376 parts In-Stock

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7,376

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Digiode

USA . 1,002 parts In-Stock

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1,002

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,043 parts In-Stock

1+ parts

$0.500

100+ parts

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1,043

$0.500

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$18.779

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272

$18.779

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A-Z Elektronik GmbH

Germany . 5,733 parts In-Stock

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5,733

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TANS Electronics

Latvia . 5,158 parts In-Stock

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5,158

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SupplyDigital Components

Austria . 3,452 parts In-Stock

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3,452

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,089 parts In-Stock

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2,089

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Kulean Microsystems

USA . 1,843 parts In-Stock

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1,843

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Corphita

USA . 1,190 parts In-Stock

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1,190

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UHIMA Technologies

Türkiye . 875 parts In-Stock

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875

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Aranea Global

USA . 500 parts In-Stock

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500

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Corohmni

South Africa . 412 parts In-Stock

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412

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Kepictronics

USA . 170 parts In-Stock

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170

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Microchip USA

USA . 112 parts In-Stock

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112

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Overview

Upgrade your power management solutions with the NCN6010DTBR2G by Onsemi. This high-quality Power Management IC boasts reliable performance and efficiency, perfect for a wide range of applications. With its advanced design and superior features, this product offers unparalleled value to customers looking for top-notch power supply support circuits. Trust in Onsemi's reputation for excellence and elevate your projects with the NCN6010DTBR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature makes it easy to install and saves space on the PCB, perfect for compact designs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the PCB, optimizing space utilization.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage is common and compatible with many electronic devices, offering flexibility in application.

Power Supplies (V): 3/3.3,3/5

This IC supports multiple power supply options, making it versatile for different voltage requirements.

No. of Terminals: 14

With 14 terminals, this IC offers multiple connection points for enhanced functionality and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch saves space and allows for compact PCB layouts.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in demanding conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for operation in a wide range of environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Ni/Pd/Au provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for a secure and stable connection, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.2 mm

The low maximum seated height is ideal for slim and compact device designs, optimizing space utilization.

Width (mm): 4.4 mm

The 4.4mm width is compact, making it suitable for applications with limited space constraints.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC serves as a power supply support circuit, providing stable and efficient power delivery for connected components.

Minimum Supply Voltage (Vsup): 2.7 V

The 2.7V minimum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in design.

Length: 5 mm

The 5mm length is compact and space-saving, suitable for applications where size constraints are a concern.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures the IC can operate reliably in various commercial environments.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and secure connection, reducing the risk of signal loss or disconnection.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for efficient and precise soldering, ensuring a reliable electrical connection.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage offers compatibility with a wide range of power sources, making it versatile for different applications.

Technical Specifications

Power Management ICs NCN6010DTBR2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3,3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

NCN6010DTBR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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