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NCL30185ADR2G

Onsemi

NCL30185ADR2G by Onsemi

NCL30185ADR2G by Onsemi is a graphics display driver with 8 terminals, operating temperature range of -40 to 125 °C, and supply voltage from 8.2V to 20V. Ideal for automotive LED displays due to its small outline package and totem-pole output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,499 parts In-Stock

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5,499

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Flip Electronics

USA . 2,700 parts In-Stock

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2,700

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Bristol Electronics

USA . 2,489 parts In-Stock

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2,489

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Dan-Mar Components

USA . 2,489 parts In-Stock

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Digiode

USA . 1,581 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 844 parts In-Stock

1+ parts

$15.800

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844

$15.800

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Component Stockers USA

USA . 595 parts In-Stock

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$99.990

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595

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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Problanco Electronics

Mexico . 7,669 parts In-Stock

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Kulean Microsystems

USA . 6,005 parts In-Stock

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SupplyDigital Components

Austria . 5,344 parts In-Stock

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5,344

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TANS Electronics

Latvia . 4,158 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Corphita

USA . 1,753 parts In-Stock

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UHIMA Technologies

Türkiye . 937 parts In-Stock

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Microchip USA

USA . 488 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NCL30185ADR2G by Onsemi! This graphics display driver offers unparalleled quality and reliability, designed by a trusted manufacturer in the industry. Ideal for a wide range of applications, this product delivers exceptional performance and efficiency. Experience the value and benefits of seamless operation, high precision output, and versatile functionality. Elevate your projects to new heights with the NCL30185ADR2G - the ultimate solution for all your display driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding extra weight.

Surface Mount: YES

The surface mount capability makes installation and replacement of the graphics display driver easy and allows for compact designs in devices.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage of 20V, the graphics display driver can handle varying power requirements efficiently without risking damage.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space on circuit boards and allows for easy integration into different electronic devices.

No. of Terminals: 8

The graphics display driver with 8 terminals provides ample connectivity options for interfacing with other components and peripherals in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications where board space is limited.

Minimum Supply Voltage: 8.2 V

The minimum supply voltage of 8.2V ensures that the graphics display driver can operate even at lower power levels, enhancing its versatility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the graphics display driver can withstand elevated temperatures, ensuring reliable performance in various environments.

Output Characteristics: TOTEM-POLE

The totem-pole output configuration allows for efficient signal amplification and driving capabilities, ensuring strong and reliable output signals for the display.

Minimum Operating Temperature: -40 °C

The graphics display driver can operate in cold temperatures as low as -40 °C, making it suitable for diverse applications in different climate conditions.

Technical Specifications

Graphics Display Drivers NCL30185ADR2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

8.2 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCL30185ADR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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