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NC7SZ38M5X-L22090

Onsemi

NC7SZ38M5X-L22090 by Onsemi

The Onsemi NC7SZ38M5X-L22090 is a CMOS Logic Gate with 2 inputs, 11 ns propagation delay, and 1.8V nominal voltage. Ideal for applications requiring fast signal processing in compact spaces due to its small outline package style and open-drain output characteristics.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12,000 parts In-Stock

1+ parts

$25.420

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12,000

$25.420

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Rochester

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$0.090

1k+ parts

$0.074

10k+ parts

$0.066

42,000

-

$0.090

$0.074

$0.066

Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.083

42,000

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-

-

$0.083

Distributors (In-Stock)

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Digiode

USA . 2,050 parts In-Stock

1+ parts

$0.069

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2,050

$0.069

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Flip Electronics

USA . 42,000 parts In-Stock

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42,000

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Vyrian

USA . 5,065 parts In-Stock

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5,065

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Distributors (Availability)

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Corphita

USA . 403 parts In-Stock

1+ parts

$0.066

100+ parts

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403

$0.066

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-

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Corohmni

South Africa . 260 parts In-Stock

1+ parts

$0.071

100+ parts

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260

$0.071

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AZTECH Wire

Italy . 1,007 parts In-Stock

1+ parts

$14.690

100+ parts

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1,007

$14.690

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QUARKTWIN TECHNOLOGY LTD

USA . 11,785 parts In-Stock

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11,785

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TANS Electronics

Latvia . 6,678 parts In-Stock

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6,678

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Problanco Electronics

Mexico . 6,221 parts In-Stock

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SupplyDigital Components

Austria . 5,180 parts In-Stock

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Microchip USA

USA . 4,596 parts In-Stock

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4,596

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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989

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Kulean Microsystems

USA . 883 parts In-Stock

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883

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Overview

Discover the Onsemi NC7SZ38M5X-L22090 Logic Gate, a high-quality product from a reputable manufacturer. With a compact design and fast propagation delay, this logic gate is perfect for applications requiring quick response times. Whether you're designing consumer electronics, industrial automation systems, or automotive components, this versatile component offers unmatched performance and reliability. Trust Onsemi to provide cutting-edge solutions that exceed your expectations. Elevate your projects with the NC7SZ38M5X-L22090 Logic Gate today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for portable or rugged applications.

Propagation Delay At Nominal Supply: 11 ns

Fast propagation delay ensures quick signal processing, making the logic gate efficient for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and space-saving integration on PCBs, enhancing the overall design efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V makes this logic gate energy-efficient and suitable for battery-powered devices.

No. of Terminals: 5

Having a small number of terminals simplifies the circuit connection process and reduces the chances of wiring errors.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the logic gate can withstand challenging environmental conditions without compromising performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption and high noise immunity, making the logic gate reliable in various applications.

Technical Specifications

Logic Gates NC7SZ38M5X-L22090 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

13.2 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

NC7SZ38M5X-L22090 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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