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NC7SZ126L6X-L22175

Onsemi

NC7SZ126L6X-L22175 by Onsemi

The Onsemi NC7SZ126L6X-L22175 is a bus driver with 11.5 ns propagation delay, suitable for industrial applications. It operates at 1.8V nominal voltage and has a load capacitance of 50 pF. With a small outline package style, it features dual terminal position and true output polarity for efficient signal transmission in compact designs.

Median Price

$0.135

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,000 parts In-Stock

1+ parts

$0.135

100+ parts

$0.130

1k+ parts

$0.087

10k+ parts

-

5,000

$0.135

$0.130

$0.087

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Verical

USA . 5,000 parts In-Stock

1+ parts

-

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$0.151

5,000

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$0.151

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$0.101

5,000

-

-

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$0.101

Distributors (In-Stock)

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Vyrian

USA . 8,395 parts In-Stock

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8,395

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Digiode

USA . 2,027 parts In-Stock

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2,027

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,682 parts In-Stock

1+ parts

$0.077

100+ parts

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4,682

$0.077

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Corohmni

South Africa . 234 parts In-Stock

1+ parts

$0.091

100+ parts

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234

$0.091

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Microchip USA

USA . 8,697 parts In-Stock

1+ parts

$0.753

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8,697

$0.753

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$11.520

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648

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TANS Electronics

Latvia . 8,194 parts In-Stock

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Kulean Microsystems

USA . 7,410 parts In-Stock

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7,410

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SupplyDigital Components

Austria . 3,828 parts In-Stock

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3,828

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Continental Prestige Electronics

USA . 3,825 parts In-Stock

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3,825

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Corphita

USA . 2,427 parts In-Stock

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UHIMA Technologies

Türkiye . 990 parts In-Stock

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990

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Problanco Electronics

Mexico . 837 parts In-Stock

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837

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Argo Parts USA

USA . 45 parts In-Stock

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45

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Overview

Discover the unparalleled quality and reliability of the NC7SZ126L6X-L22175 by Onsemi, a leading manufacturer in the industry. This Bus Driver & Transceivers component is designed to provide seamless communication in various applications, offering a fast propagation delay and 3-state output characteristics. With a compact design and wide temperature range, this product delivers exceptional performance and durability. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NC7SZ126L6X-L22175 and experience the difference today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and standardized form factor for easy handling and placement within electronic systems.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable and accurate signal transmission, enhancing the reliability of the product.

Power Supplies (V): 3.3

Common power supply voltage compatibility makes it versatile and compatible with a wide range of electronic systems.

No. of Terminals: 6

Optimal number of terminals for efficient connectivity and signal routing, simplifying the design and assembly process.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and thin profile package style saves space and weight, making it suitable for compact and portable electronic devices.

Maximum I (ol): 32 Amp

High maximum output current capability enables driving of multiple loads or devices without the need for external drivers.

Propagation Delay (tpd): 13.8 ns

Low propagation delay ensures minimal signal delay, improving the overall performance and responsiveness of the product.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable operation in various environmental conditions, increasing the product's versatility.

Output Characteristics: 3-STATE

3-state output capability provides flexibility in signal routing and control, enabling efficient data transmission and bus management.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme temperature environments, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable and corrosion-resistant terminal finish ensures long-term reliability and robustness in harsh operating conditions.

Terminal Position: DUAL

Dual terminal position allows for flexible and versatile connection options, optimizing the integration and compatibility of the product.

No. of Ports: 2

Dual ports provide connectivity options for multiple devices or systems, enabling efficient data exchange and communication.

Maximum Seated Height: 0.55 mm

Low seated height profile enables compact and space-saving design, ideal for applications with limited vertical clearance.

Width: 1 mm

Narrow width profile allows for dense and efficient packing of components on a circuit board, maximizing the use of available space.

Output Polarity: TRUE

True output polarity ensures correct signal transmission and compatibility with other components, reducing the risk of signal errors or misinterpretation.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement enables operation in low-power scenarios, improving energy efficiency and prolonging battery life.

Length: 1.45 mm

Compact length dimension allows for efficient and space-saving layout within electronic systems, facilitating compact and portable device designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments, enhancing the product's durability and longevity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joint cracking, enhancing reliability and durability in high-vibration environments.

Packing Method: TR

Tape and reel packing method provides efficient handling and assembly process, enabling automated placement on circuit boards for mass production.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact layout and efficient connection density on circuit boards, optimizing space utilization and signal integrity.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies signal routing and data management, reducing complexity in system design and operation.

Control Type: ENABLE HIGH

Enable high control type offers easy and efficient activation of the device, allowing for seamless integration and operation within electronic systems.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage range provides compatibility with various power sources, offering flexibility and adaptability in different applications.

Maximum Power Supply Current (ICC): 50 mA

Low power supply current consumption minimizes energy usage, reducing operating costs and heat dissipation, making it energy-efficient.

Technical Specifications

Bus Driver & Transceivers NC7SZ126L6X-L22175 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

13.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NC7SZ126L6X-L22175 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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