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NC7ST04M5X-L22090

Onsemi

NC7ST04M5X-L22090 by Onsemi

The Onsemi NC7ST04M5X-L22090 is a CMOS Logic Gate with 31ns Propagation Delay at 5V. It features a load capacitance of 50pF, max I (ol) of 2A, and operates b/w -40 to 85 °C. Ideal for applications requiring fast signal processing in compact designs due to its small outline package and low profile design.

Median Price

$0.129

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Arrow

USA . 3,000 parts In-Stock

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$0.156

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$0.102

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$0.084

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$0.156

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Avnet

USA . 9,000 parts In-Stock

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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$0.102

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$0.084

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$0.102

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Flip Electronics

USA . 96,000 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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Vyrian

USA . 2,817 parts In-Stock

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Digiode

USA . 1,909 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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$0.103

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Microchip USA

USA . 4,804 parts In-Stock

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$0.655

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AZTECH Wire

Italy . 1,106 parts In-Stock

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$18.310

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Component Stockers USA

USA . 510 parts In-Stock

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510

$99.990

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Eastek

USA . 9,000 parts In-Stock

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TANS Electronics

Latvia . 6,959 parts In-Stock

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SupplyDigital Components

Austria . 6,926 parts In-Stock

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Problanco Electronics

Mexico . 3,871 parts In-Stock

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Kulean Microsystems

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Corphita

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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Overview

Boost your electronic projects with the NC7ST04M5X-L22090 logic gate by Onsemi. Manufactured with top-quality plastic/epoxy material, this small outline, low profile device offers fast propagation delay, dual terminals, and a wide operating temperature range. Perfect for a variety of applications, this logic gate provides reliable performance and precise operation. Trust Onsemi to deliver high-quality components for all your design needs. Elevate your projects with the NC7ST04M5X-L22090 and experience the superior value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the logic gates, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 31 ns

Low propagation delay ensures fast signal processing and efficient operation of the logic gates.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the logic gates on circuit boards, saving time and effort.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with most electronic systems and easy to integrate.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stability and performance of the logic gates in various applications.

No. of Terminals: 5

Minimal number of terminals simplifies circuit design and reduces complexity in connecting the logic gates.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low profile package design saves space on the circuit board and allows for dense packing of components.

Maximum I (ol): 2 Amp

High output current capability enables driving of larger loads without external amplification, increasing versatility of the logic gates.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in both high and low temperature environments.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes the logic gates suitable for a variety of industrial and automotive applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and facilitates easy connection of the logic gates in different configurations.

Maximum Seated Height: 1.45 mm

Low seated height allows for a compact and slim profile of the logic gates, ideal for space-constrained applications.

Width: 1.6 mm

Narrow width of the logic gates enables efficient use of board space and facilitates close placement of components for improved signal integrity.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources and allows for versatile use.

Length: 2.9 mm

Compact length of the logic gates further contributes to space-saving design and efficient PCB layout.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring robust electrical connectivity of the logic gates.

Packing Method: TR

TR packing method offers protection and convenient handling of the logic gates during storage and transportation.

Terminal Pitch: 0.95 mm

Narrow terminal pitch simplifies PCB routing and enables efficient packing of components for increased circuit density.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance protects the logic gates from overvoltage conditions, increasing overall robustness and reliability.

Maximum Power Supply Current (ICC): 25 mA

Low maximum power supply current requirement minimizes power consumption and heat dissipation, contributing to energy efficiency and reliability of the logic gates.

Technical Specifications

Logic Gates NC7ST04M5X-L22090 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HST/T

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

31 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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