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NBXSBA030LN1TAG

Onsemi

NBXSBA030LN1TAG by Onsemi

NBXSBA030LN1TAG clock generator by Onsemi operates at a max output frequency of 175 MHz with supply voltages of 2.5/3.3 V. It is designed for industrial applications, featuring a small outline package style and CMOS technology. This surface-mount device has a temperature range from -40 to 85 °C, making it suitable for various electronic systems.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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AZTECH Wire

Italy . 759 parts In-Stock

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Problanco Electronics

Mexico . 5,511 parts In-Stock

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SupplyDigital Components

Austria . 4,915 parts In-Stock

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Corphita

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Corohmni

South Africa . 439 parts In-Stock

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UHIMA Technologies

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TANS Electronics

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Microchip USA

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Kulean Microsystems

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Overview

Elevate your technology with the NBXSBA030LN1TAG clock generator from Onsemi, a leading manufacturer known for its high-quality components. Designed for a wide range of applications, this small outline package offers customers the advantage of precise clock frequency output up to 175 MHz, making it ideal for industrial-grade systems. With a nominal supply voltage of 3.3 V and a maximum operating temperature of 85 °C, this clock generator ensures reliable performance while providing ease of installation with its surface mount design. Upgrade your projects today with the value and benefits that Onsemi's NBXSBA030LN1TAG clock generator brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making this clock generator suitable for a variety of industrial applications.

Maximum Output Clock Frequency: 175 MHz

The high maximum output clock frequency of 175 MHz allows for fast and efficient operation, making this clock generator ideal for applications requiring high-speed performance.

Power Supplies (V): 2.5/3.3

The dual power supply options of 2.5V and 3.3V provide flexibility in voltage selection, allowing for compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this clock generator can perform reliably even in high-temperature environments, ensuring consistent operation.

Technology: CMOS

The CMOS technology used in this clock generator helps in reducing power consumption, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Clock Generators NBXSBA030LN1TAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATES AT 2.5V SUPPLY

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

175 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Equivalence Code:

DILCC6,.2

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

105 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXSBA030LN1TAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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