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NBXDDA016LNHTAG

Onsemi

NBXDDA016LNHTAG by Onsemi

Onsemi's NBXDDA016LNHTAG clock generator operates at a max frequency of 137.93 MHz with supply voltage ranging from 2.97V to 3.63V. Ideal for industrial applications, this CMOS technology-based device has a small outline package style and is surface mountable, featuring 6 terminals in a rectangular shape.

Median Price

$6.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 876 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

876

-

$5.610

$5.020

$4.720

DigiKey

USA . 876 parts In-Stock

1+ parts

-

100+ parts

$6.500

1k+ parts

$6.500

10k+ parts

$6.500

876

-

$6.500

$6.500

$6.500

Verical

USA . 876 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.638

10k+ parts

-

876

-

$7.013

$6.638

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,200 parts In-Stock

1+ parts

$5.938

100+ parts

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1,200

$5.938

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Vyrian

USA . 7,037 parts In-Stock

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7,037

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Distributors (Availability)

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Ampacity Inc.

Singapore . 626 parts In-Stock

1+ parts

$4.800

100+ parts

-

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626

$4.800

-

-

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Corphita

USA . 1,037 parts In-Stock

1+ parts

$5.625

100+ parts

-

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1,037

$5.625

-

-

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Corohmni

South Africa . 134 parts In-Stock

1+ parts

$5.650

100+ parts

-

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134

$5.650

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SupplyDigital Components

Austria . 7,788 parts In-Stock

1+ parts

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7,788

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-

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TANS Electronics

Latvia . 6,835 parts In-Stock

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6,835

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Kulean Microsystems

USA . 2,394 parts In-Stock

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2,394

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Continental Prestige Electronics

USA . 876 parts In-Stock

1+ parts

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876

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UHIMA Technologies

Türkiye . 779 parts In-Stock

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779

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Problanco Electronics

Mexico . 651 parts In-Stock

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651

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Microchip USA

USA . 371 parts In-Stock

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371

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Overview

Unlock the power of precision timing with the NBXDDA016LNHTAG clock generator by Onsemi. Crafted with quality ceramic and metal-sealed cofired materials, this small outline package offers a maximum output clock frequency of 137.93 MHz, making it perfect for industrial applications where accuracy is key. With a maximum supply voltage of 3.63V and a wide temperature range, this clock generator ensures reliable performance in any environment. Trust in Onsemi's expertise to deliver unmatched value and efficiency, bringing seamless integration and superior timing solutions to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures reliable performance and durability of the clock generator.

Maximum Output Clock Frequency: 137.93 MHz

High maximum output clock frequency allows for potentially faster and more accurate clock signals.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the clock generator to function in various environments, including extreme cold conditions.

Maximum Seated Height: 1.9 mm

Low seated height makes the clock generator suitable for compact and slim electronic devices.

Technology: CMOS

The CMOS technology used in this clock generator offers low power consumption and high noise immunity.

Technical Specifications

Clock Generators NBXDDA016LNHTAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

137.93 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Equivalence Code:

DILCC6,.2

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXDDA016LNHTAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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