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NBSG72AMNG

Onsemi

NBSG72AMNG by Onsemi

NBSG72AMNG by Onsemi is a 16-terminal cross point switch with a supply voltage range of +-2.5/+-3.3V, suitable for industrial applications. Featuring a compact square package style and surface mount design, it operates b/w -40 to 85°C with terminal finish in nickel gold palladium for reliability. Ideal for multiplexers & switches requiring low-profile solutions.

Median Price

$18.518

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,110 parts In-Stock

1+ parts

-

100+ parts

$16.460

1k+ parts

$14.730

10k+ parts

$13.860

2,110

-

$16.460

$14.730

$13.860

Verical

USA . 2,110 parts In-Stock

1+ parts

-

100+ parts

$20.575

1k+ parts

$18.413

10k+ parts

-

2,110

-

$20.575

$18.413

-

Distributors (In-Stock)

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Digiode

USA . 2,225 parts In-Stock

1+ parts

$17.414

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2,225

$17.414

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Vyrian

USA . 2,435 parts In-Stock

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2,435

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Nova Conductors

Japan . 1,000 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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Lantek

USA . 5 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 98 parts In-Stock

1+ parts

$9.710

100+ parts

-

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98

$9.710

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$9.930

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-

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820

$9.930

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Ampacity Inc.

Singapore . 7,404 parts In-Stock

1+ parts

$15.580

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7,404

$15.580

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Corphita

USA . 2,453 parts In-Stock

1+ parts

$16.497

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2,453

$16.497

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Corohmni

South Africa . 239 parts In-Stock

1+ parts

$17.950

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239

$17.950

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SupplyDigital Components

Austria . 8,234 parts In-Stock

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Continental Prestige Electronics

USA . 7,973 parts In-Stock

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$14.690

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$14.690

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Kulean Microsystems

USA . 7,664 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,238 parts In-Stock

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Problanco Electronics

Mexico . 7,021 parts In-Stock

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Argo Parts USA

USA . 3,983 parts In-Stock

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Microchip USA

USA . 3,916 parts In-Stock

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Perfect Parts

USA . 1,690 parts In-Stock

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1,690

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Futuretech Components

Singapore . 705 parts In-Stock

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705

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UHIMA Technologies

Türkiye . 592 parts In-Stock

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592

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TANS Electronics

Latvia . 568 parts In-Stock

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568

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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300

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Kepictronics

USA . 213 parts In-Stock

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GreenTree Electronics

Israel . 155 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock a world of possibilities with the NBSG72AMNG by Onsemi. This innovative multiplexer offers unparalleled quality and reliability, making it the go-to choice for a wide range of applications. From industrial automation to telecommunications, this versatile device is designed to deliver top-notch performance every time. With Onsemi's commitment to excellence and cutting-edge technology, you can trust that the NBSG72AMNG will exceed your expectations. Experience the value and benefits this product has to offer and take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes this product easy to integrate onto circuit boards, saving space and allowing for efficient assembly.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a common nominal supply voltage of 2.5 V allows for compatibility with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of nickel gold palladium for terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Width (mm): 3 mm

Compact width of 3 mm allows for space-saving installation in tight circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh industrial environments.

Technical Specifications

Multiplexers & Switches NBSG72AMNG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -2.375V TO -3.465V

Other IC type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NBSG72AMNG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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